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Briefs Electronics & Computers
Using High-Performance Computing Clusters to Support Fine-Grained Parallel Applications
A heterogeneous cluster comprised of host processors and field programmable gate arrays (FPGAs) was used to accelerate the performance of parallel...
Briefs Electronics & Computers
Asynchronous Architectures for Large-Integer Processors
New architectures have been developed for cryptographic hardware that offer high throughput, algorithm flexibility, radiation hardness, and low power. The asynchronous (clockless) architecture combines a dedicated large-integer processor (LIP), a field programmable gate array (FPGA), and a...
Briefs Electronics & Computers
Evaluation of Four Methods of Reconfiguring an FPGA
A study was performed to evaluate the relative merits of four methods of reconfiguring a field-programmable gate array (FPGA) in response to detection of a faulty configurable logic block...
Briefs Electronics & Computers
High-Voltage, High-Temperature Power Electronics Capacitor
A novel high-temperature, high-voltage power electronics capacitor incorporates materials of construction and electrical components that have been initially designed as a segment of an...
Briefs Electronics & Computers
Fuzzy System for Fault Diagnostics in Power Electronics-Based Brake-by-Wire System
Research in fuzzy diagnostics of brake-by-wire systems focuses on the power electronics switches, since they are often considered to be the weakest link in the...
Briefs Electronics & Computers
AC Coupled Interconnect for Low-Power Spaceborne Electronics
An AC coupled interconnect (ACCI) has been developed that could be used to create multiple solutions to contactless chip-to-chip communications. Assembly and testing of a 0.18 um bulk...
Briefs Electronics & Computers
Emerging Power and Energy Technologies for Portable Electronics
A report discusses data obtained for the Navy's Special Operations Command (SOCOM), which seeks a portable power/energy source capable of providing sufficient power and energy for complex missions at a minimal weight penalty. The report focuses on the specific energy of systems,...
Briefs Electronics & Computers
High-Cycle Life Testing of RF MEMS Switches
The electromechanical, RF, and charging properties of an "air-gap" capacitive switch enable it to be utilized in high-cycle life testing. Monitoring both high-speed and low-speed switching...
Briefs Electronics & Computers
Optical Microwave-Signal-Channelization Technique Analyzed
In a recent study, a proposed technique for optical frequency-band channelization of a microwave signal or other wide-band radio signal in a receiver was analyzed and compared with...
Briefs Electronics & Computers
Magnetic Memory Devices for Embedded Computing
A program of research has been dedicated to the development of magnetic memory devices than can be incorporated into complementary metal oxide/semiconductor (CMOS) integrated circuits, wherein...
Briefs Electronics & Computers
Effects of High-Power Microwave Pulses on Electronic Systems
A five-year program comprising several coordinated research efforts was devoted to increasing understanding and developing capabilities for computational modeling of the effects of...
Briefs Electronics & Computers
Laser-Based System for Measuring and Analyzing Vibrations
A system for noncontact measurement and analysis of vibrations of an electronic circuit board or a similar lightweight, nominally flat, rectangular object has been developed. This...
Briefs Electronics & Computers
Microscale Electrical Contacts for Self-Assembly
An experimental study of self-assembly processes in which small, heterogeneous components become spontaneously aligned with each other and bonded through soldering of mating electrical contacts...
Briefs Electronics & Computers
Use of a Heat Pipe to Cool Aircraft Electronics
The first steps have been taken in a continuing project to study the suitability of dissipating heat from electronic and electric-actuator equipment aboard an aircraft by using a loop heat pipe, containing water as the working fluid, that delivers the heat to the exterior aircraft skin. The first...
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