Vent for Electronics Housings

January 28, 2014

Patrick Ponticel

The smaller total vent height (only 8.9 mm, or 0.35 in) provides more flexibility in component layout and facilitates heat transfer from printed circuit boards to the housing exterior.

The new GORE PolyVent Compact Series from W.L. Gore & Associates, Inc. offers higher-performance venting for automotive electronics housings in a footprint about 30% smaller than the widely-used PolyVent Snap-Fit product family. The smaller vent diameter (only 14.3 mm, or 0.56 in) makes it easier to integrate into today’s smaller housing designs, especially when the installed housing has very limited clearances. Low installed height (only 3.45 mm, or 0.16 in) affords less external protrusion and less vulnerability to mechanical impacts or steam-jets. The smaller total vent height (only 8.9 mm, or 0.35 in) provides more flexibility in component layout and facilitates heat transfer from printed circuit boards to the housing exterior. An enhanced oleophobic proprietary membrane design provides about 30% better Water Entry Pressure resistance, yet with the same airflow and chemical resistance as the PolyVent Standard and High Temperature Series.