Latest Stories
INSIDER Defense
Mercury Signs Embedded Production Agreement for AeroVironment’s Satellite Augmentation Technology
Mercury Systems announced a new production agreement with AeroVironment, Inc. (AV) to support the U.S. Space Force’s Satellite...
Products Information Technology
New Products
See the new products, including Knowles Corporation's High Q Ceramic Core Inductors; HUBER+SUHNER's VITA 67.3 interconnect portfolio designed for use with its proprietary solderless MINIBEND® RF cable termination technology; Rohde & Schwarz's updated R&S FSWP for upcoming applications; VersaLogic Corp.'s expanded line of industrial temperature, rugged expansion boards; and more.
Articles Electronics & Computers
The Future of EMI Shielding Is Lightweight, Flexible, and Ready for Flight
Modern military aircraft represent some of the most complex electronic environments ever engineered. These platforms integrate advanced avionics, radar systems, data links, and communication networks that must function seamlessly in hostile, high-frequency environments. In these mission-critical contexts, electromagnetic interference (EMI) poses a silent but serious threat that can degrade signal integrity, cause crosstalk between systems, or even lead to mission failure. Read on to learn more.
Podcasts Aerospace
Microchip’s New Processor Enables Scalable Computing Performance
Bill Dillard, Senior Manager of Aerospace and Defense at Microchip, is the guest on this episode of the Aerospace & Defense Technology podcast to explain how the PIC64 could also advance embedded processing performance for a wide variety of aerospace and defense applications.
Podcasts Software
A Quantum Accelerated Digital Twin for Aerospace and Defense Simulation
Abhishek Chopra, BQP Founder, CEO, and Chief Scientific Officer, is the guest on this episode of the Aerospace & Defense Technology podcast to explain how their simulation technology leverages quantum algorithms for simulation and modeling.
Podcasts Defense
In-Memory Computing Chip Is a Processing Breakthrough for On-Device AI Applications
EnCharge AI CEO Naveen Verma is the guest on this episode of the Aerospace & Defense Technology podcast to explain the in-memory computing architecture of their new AI chip.
Application Briefs Aerospace
G5000 Prime Flight Deck
Garmin introduced its new G5000 PRIME flight deck for Part 25 transport aircraft at the 2025 Paris Air Show. Read on to learn more.
INSIDER Connectivity
COFFEE Program to Develop Dual-Use RF Filters for Defense Systems, 6G and More
Spectrum is a limited resource, and demand is rapidly increasing. From satellites to smartphones, commercial providers are vying for more radiofrequency (RF)...
INSIDER Photonics/Optics
Fiber Deep Upgrade Improves Cyber Resilience for JBPHH
An Air National Guard fiber cable installation team is implementing the 'Fiber Deep' project on Joint Base Pearl Harbor-Hickam, Hawaii. This project aims to save up to $10 million by...
INSIDER Manufacturing & Prototyping
GURU Generation 2 Supercomputer Will Accelerate Prototyping Process for Mach 5 Vehicles
MSBAI, a California-based AI design and simulation startup, has been awarded a $2 million Phase III contract by the U.S. Department of Defense (DoD) for...
INSIDER AR/AI
Google, OpenAI to Lead Development of AI Agents for Department of Defense
The Chief Digital and Artificial Intelligence Office (CDAO) announced individual contract awards — each with a $200 million ceiling — to Anthropic, Google, OpenAI...
INSIDER RF & Microwave Electronics
Paris Air Show: New Aerospace Technologies, Updates and Research
Did you miss the product launches, partnership agreements and other updates at the 2025 Paris Air Show? Check out this recap of some of the technology highlights from the event.
INSIDER Aerospace
TEWS Introduces First VITA 93 QMC Modules
TEWS Technology, the Pinneberg, Germany-based embedded computing supplier, announced the release of its first QMC modules, and the TPCE210 dual-site carrier card, fully compliant with the emerging...
Products Electronics & Computers
New Products
See the new products, including Microchip's BR235 and BR235D series of 25A QPL hermetically sealed electromechanical power relays; PIC Wire & Cable’s new Single Pair Ethernet; Galleon Embedded Computing's high performance recorder (HPR); Pixus Technologies' new SOSA aligned ATR enclosures utilizing the 3U OpenVPX form factor; and more.
Top Stories
INSIDERRF & Microwave Electronics
FAA to Replace Aging Network of Ground-Based Radars
PodcastsDefense
A New Additive Manufacturing Accelerator for the U.S. Navy in Guam
NewsSoftware
Rewriting the Engineer’s Playbook: What OEMs Must Do to Spin the AI Flywheel
Road ReadyPower
2026 Toyota RAV4 Review: All Hybrid, All the Time
INSIDERDefense
F-22 Pilot Controls Drone With Tablet
INSIDERRF & Microwave Electronics
L3Harris Starts Low Rate Production Of New F-16 Viper Shield
Webcasts
Automotive
Hydrogen Engines Are Heating Up for Heavy Duty
Power
SAE Automotive Podcast: Solid-State Batteries
Automotive
SAE Automotive Engineering Podcast: Additive Manufacturing
Aerospace
A New Approach to Manufacturing Machine Connectivity for the Air Force
Software
Optimizing Production Processes with the Virtual Twin
