New Products

September 1, 2025

End Mills for Aerospace Cutting

EMUGE-FRANKEN USA (West Boylston, MA) has announced that the EMUGE TiNox-Cut High Performance End Mills Line is now being manufactured in its facility. These end mills, named TiNox-Cut VAR, are application-specific for the machining of tough materials. Ideal for high impact applications, TiNox-Cut VAR End Mills are made from premium sub-micron grade solid carbide with a maximized transverse rupture strength. Ideal for high impact applications, TiNox-Cut VAR End Mills are made from premium sub-micron grade solid carbide with a maximized transverse rupture strength. The tools have advanced PVD applied coatings for heat and wear resistance, and an axial internal coolant channel design offers maximum chip evacuation performance and chip cooling ability.

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High Performance Inductors

Knowles Corporation (Itasca, IL) announced the introduction of its High Q Ceramic Core Inductors, designed to optimize RF efficiency and signal integrity across mission-critical applications in medical, defense, and industrial sectors. “This launch marks a strategic expansion of Knowles’ Ceramic Capacitors portfolio into adjacent technologies, leveraging our core expertise in advanced materials,” said Knowles’ VP of Ceramic Capacitors, Amrita Khemchandani. “In mission critical electronic circuits, inductors often work alongside the high-performance capacitors we already supply. By adding inductors to our passive components lineup, we simplify circuit design and empower our customers with greater insight into the applications where these components are essential.”

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TVS Diodes

Littelfuse, Inc. (Rosemont, IL) announced the launch of the 5.0SMDJ-FB TVS Diode Series, a 5,000 W surface-mount solution in a DO-214AB package engineered to protect sensitive DC power lines from overvoltage transients. The new series incorporates foldback technology, which delivers up to 15 percent lower clamping voltage (VC) compared to traditional solutions, while maintaining Breakdown Voltage (VBR) above the Reverse Standoff Voltage (VR). This key differentiator ensures reliable protection for increasingly sensitive downstream components — especially next-generation DC/DC converters — without compromising system integrity.

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ICMD Software Platform

QuesTek Innovations (Evanston, IL) has introduced new titanium alloy modeling capabilities within its ICMD® (Integrated Computational Materials Design) Software Platform, further extending its depth and utility. ICMD® is a cloud-based platform that QuesTek is constantly enhancing to meet the evolving needs of materials engineers, reducing risk and accelerating development from concept to qualification. This latest expansion provides greater insight into the behavior of Ti alloys for aerospace, energy, and additive manufacturing amongst other industry/applications segments. The latest ICMD® release introduces models to estimate key mechanical properties of Ti-based alloys, including elastic modulus, shear modulus, Poisson’s ratio, yield strength, and ultimate tensile strength, all based on alloy chemistry and processing parameters. These tools allow users to screen and optimize alloy candidates earlier in the development process, reducing reliance on costly and time-consuming experiments.

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Next-Generation Embedded Security Testbench

Keysight Technologies, Inc. (Santa Rosa, CA) announced the launch of the Next-Generation Embedded Security Testbench, a consolidated and scalable test solution designed to address the increasing complex security testing demands of modern chips and embedded devices. The new testbench leverages a high-speed PXIe architecture designed to address the complexities of modern security testing needs. It represents a significant evolution of the Device Vulnerability Analysis product line. This robust architecture enables the Next-Generation Embedded Security Testbench to deliver up to 10 times more effective results in side-channel analysis (SCA) and fault injection (FI) testing, crucial techniques for identifying and mitigating hardware-based vulnerabilities.

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XPedite7770 Single Board Computer

X-ES’s (Verona, WI) XPedite7770 3U VPX-REDI Module is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring maximum data and information protection. This 3U VPX-REDI module integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite7770 provides incredible speed with 100GBASE-KR4, 10GBASE-KR, and 10/100/1000BASE-T Ethernet ports.

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VITA 93 QMC Modules

TEWS Technologies (Pinneburg, Germany) announced the release of a comprehensive new portfolio of QMC modules and the TPCE210 dual-site carrier card, fully compliant with the emerging VITA 93 – QMC Mezzanine Card standard. The new VITA 93 – QMC standard solves many problems in current mezzanine I/O card standards through its innovative QMC architecture, enabling unprecedented modularity, flexibility, and scalability while maintaining backward compatibility and rugged reliability. VITA 93 – QMC builds on lessons learned from previous standards, blending their best features with new capabilities for the future. VITA 93 – QMC modules, more compact and powerful than previous standards, offer a single design for air- and conduction-cooled systems, PCIe Gen6 up to x16, IPMI system management, and high-density I/O.

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Next Generation AI Processor

Leonardo DRS (Arlington, VA) introduced its high-performance Artificial Intelligence Processor (AIP) latest computing system, designed to quickly deliver real-time threat detection, situational awareness, and advanced mission processing directly to military vehicles. Built for highspeed processing in extreme environments, the ruggedized AIP integrates with AI algorithms in current and future U.S. Army combat applications and is engineered to process vast amounts of battlefield data, from advanced image sensors to sensor fusion systems. The system rapidly delivers actionable intelligence to soldiers at the tactical edge across the U.S. Army’s ground vehicle fleet.

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VITA 67.3 RF Interconnect

HUBER+SUHNER (Charlotte, NC) has introduced an all-new VITA 67.3 interconnect portfolio designed for use with its proprietary solderless MINIBEND® RF cable termination technology. This new connectivity portfolio is a game-changer for the ever-evolving minimization needs of the global aerospace and defense markets. The VITA 67.3 standard enables reliable, high-frequency signal transmission in aerospace and defense applications by standardizing blind-mate RF interfaces at the backplane. This helps reduce cable management challenges and enhances system modularity and scalability. With the launch of the HUBER+SUHNER’s VITA 67.3 interconnect portfolio, engineers now have access to high performance coaxial cable options featuring the industry’s smallest bend radius immediately behind the RF contact, enabling extremely tight routing without sacrificing durability or performance.

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FSWP Phase Noise Analyzer

Rohde & Schwarz (Columbia, MD) has updated the R&S FSWP for upcoming applications. The new option R&S FSWP-B56G extends the frequency range up to 56 GHz. With the support of external high-end sources as local oscillators it combines the advantage of an easy-to-use signal source analyzer and a high-end phase noise tester. For additive and residual phase noise measurements on amplifiers Rohde & Schwarz has extended the frequency range of the internal signal source up to 54 GHz. In addition, a new and very easy method for noise figure measurements has been added. In addition, the updated R&S FSWP now supports external signal sources as local oscillators for absolute phase noise measurements up to 56 GHz.

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Mini PCIe Expansion Board

VersaLogic Corp. (Tualatin, OR) expanded its line of industrial temperature, rugged expansion boards with the “P3” module. The dual Mini PCIe socket expansion board offers an effective and reliable solution for adding expansion cards to VersaLogic’s “Sabertooth” embedded computer and other compatible PCIe/104 systems. “Customers can now easily add up to two additional Mini PCIe cards to their embedded systems, even in industrial temperature applications (-40°C to +85°C),” said Len Crane, VersaLogic’s President. The P3 features two full-size Mini PCIe sockets for a wide variety of off-the-shelf expansion cards, such as Ethernet, AI/GPU, and other standard I/O functions.

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Spectrum Dominance 2.0

Silvus Technologies, Inc. (Los Angeles, CA) announced the launch of Spectrum Dominance 2.0 - the next evolution of its EW resilient communications capabilities. Available as a software licensable extension to Silvus’ battle-proven MN-MIMO waveform, Spectrum Dominance 2.0 adds new features including Wake on Wireless and Dual Frequency Link to an ever-expanding suite of Low Probability of Intercept/Low Probability of Detection (LPI/LPD), Anti-Jam (AJ) and Advanced Threat Protection (ATP) capabilities that provide secure and protected mesh network communications in the most contested RF environments. Together, they enable Stream-Caster MANET radios (AN/PRC-169) to perform in congested and contested environments – empowering their operators with robust, mission-critical communications solutions to achieve their mission objectives even under electronic attack.

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Sapphire Windows for Aerospace and Defense Applications

Custom fabricated sapphire windows, lenses, and domes that exhibit extreme hardness, chemical resistance, and the ability to withstand high temperatures have been introduced by Meller Optics, Inc. (Providence, RI). Meller’s Sapphire Windows are ideal for aerospace and military applications where they would be subjected to fast moving particles, harsh chemicals, temps. to 1,000 °C and pressures to 10,000 psi. Featuring Mohs 9 hardness which is second only to diamond, combined with high clarity, they are perfect for protecting sensors, and optics in guidance and vision systems. Providing up to 85 percent transmission from the UV to IR, Meller Sapphire Windows can include A/R coatings for enhancing transmission to better than 99 percent. Offered in sizes from 1/4” to 10” dia. and 1/2 mm to 1” thick, flatness can be held to 0.5 fringes of HeNe, parallelism from 20 to 2 arc/secs., and they have surface finishes from 60-40 to 40-20 scratch-dig.

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