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Application Briefs

Electronics & Computers

Nanoscale Thermal Prediction for Real-World Chip Design

DARPA’s Microsystems Technology Office launched the Thermal Modeling of Nanoscale Transistors (Thermonat) effort, which aims to combine the accuracy of atom-level physics with the speed required for industry design timelines, targeting predictions within 1°C of ground truth and reducing computation time by more than 1,000x. Read on to learn more.

Webinars

Electronics & Computers

Advantages of Smart Power Distribution Unit Design for Automotive & Transportation

Engineers face increasing pressure to design power distribution units (PDU) that can support higher complexity, greater electrification, and stricter safety...

Products

Software

New Products

See the new products, including Kontron's VX307C, a rugged 3U VPX computing module based on the Intel® Xeon® D-1700/1800 platform; Concurrent's Narvi, a rugged XMC form factor GPGPU and graphics processing card developed in collaboration with EIZO Rugged Solutions; ITT Cannon’s C5 Warrior connectors; and more.

INSIDER

Manufacturing & Prototyping

AUSA 2025: New CMOSS Chassis, Plug-in-Card Prototypes in Development for Army Vehicles

The U.S. Army has selected two companies to develop prototype chassis and plug-in-cards for aviation and ground vehicles. The selection is the Army’s...

Products

Energy

New Products

See the new products, including Nexperia's ESD diodes designed to protect 48V automotive data communications networks against the destructive effects of electrostatic discharge events; Comau's collaboration with Intecells to optimize the use of cold plasma within industrial cell manufacturing processes; Carlo Gavazzi Automation's UWP-DLB Series, an advanced solution delivering intelligent dynamic load balancing for EV charging systems; and more.

Briefs

Semiconductors & ICs

Could Metasurfaces Be The Next Quantum Information Processors?

Optics researchers in the Harvard John A. Paulson School of Engineering and Applied Sciences have created specially designed metasurfaces — flat devices etched with nanoscale light-manipulating patterns — to act as ultra-thin upgrades for quantum-optical chips and setups. Read on to learn more.

Briefs

Materials

New 3D Chips Could Make Electronics Faster and More Energy-Efficient

Researchers from MIT and elsewhere have developed a new fabrication process that integrates high-performance GaN transistors onto standard silicon CMOS chips in a way that is low-cost and scalable, and compatible with existing semiconductor foundries. Read on to learn more.

Products

Electronics & Computers

New Products

See the new products, including Knowles Corporation's High Q Ceramic Core Inductors; HUBER+SUHNER's VITA 67.3 interconnect portfolio designed for use with its proprietary solderless MINIBEND® RF cable termination technology; Rohde & Schwarz's updated R&S FSWP for upcoming applications; VersaLogic Corp.'s expanded line of industrial temperature, rugged expansion boards; and more.

News

Connectivity

Audio Updates You Can’t Even Hear

While autonomous driving, electric powertrains and the evolving role of AI in automotive get most of the attention (deservedly, sure), technological advancements aimed at the audio experience in...

Products

Manufacturing & Prototyping

New Products

See the new products, including Microchip Technology's PolarFire® Core Field-Programmable Gate Arrays and System on Chips; an electromechanical subsea actuator from WITTENSTEIN motion control Gmbh; PI's expansion of its PICMA® piezo stack actuator series; Samtec, Inc.'s microwave cable assemblies using Nitrowave™ cable technology; and more.

INSIDER

Electronics & Computers

TEWS Introduces First VITA 93 QMC Modules

TEWS Technology, the Pinneberg, Germany-based embedded computing supplier, announced the release of its first QMC modules, and the TPCE210 dual-site carrier card, fully compliant with the emerging...

Podcasts

Electronics & Computers

How Will TSN Ethernet Impact the Future of Embedded Computing?

Nigel Forrester, Director of Product Strategy, Concurrent Technologies, discusses the future of TSN Ethernet for aerospace and defense applications on this episode of the Aerospace & Defense Technology podcast.

Videos

RF & Microwave Electronics

Intel's Progress on Developing Next-Generation Computer Chips for Defense Applications

Watch this video from Aerospace & Defense Technology to learn how Intel has been advancing the development of prototype computer chips for defense applications in recent years, as well as insights about their Intel18A technology.

INSIDER

Design

Microsoft, PsiQuantum Designing Quantum Computer Prototypes for DARPA US2QC Program

The Defense Advanced Research Projects Agency (DARPA) has selected Microsoft and PsiQuantum to move to the final design stage of its Underexplored Systems...

Articles

Materials

Advanced Silicones for ADAS in Light Vehicles

Today’s ADAS designers are adding more electronic components and redundant computing systems to printed circuit boards (PCBs). These heat-generating electronic assemblies are installed in...

INSIDER

Aerospace

Researchers Achieve Breakthrough in New Design of Superconducting Quantum Processor

Researchers at the University of Chicago Pritzker School of Molecular Engineering have realized a new design for a superconducting quantum processor —...

Application Briefs

Manufacturing & Prototyping

Quantum Processor Unit Manufacturing

STMicroelectronics has signed a new collaboration agreement with French quantum computing startup Quobly to produce quantum processor units at scale. This collaboration is set to make large-scale quantum computing feasible and cost-effective. Read on to learn more.

Articles

Software

Analog Transformation Complements Open System Designs to Optimize Modern Defense Systems

Miniature, modular, and intelligent gateways can be embedded into analog components to replace and re-imagine old firmware and analog mitigation circuitry. These new, embedded gateways promise to bring open architecture deeper into the tactical edge and realize a new level of agility throughout the lifecycle of a system, from design through sustainment of hybrid digital and analog systems. Read on to learn more.

INSIDER

RF & Microwave Electronics

Lockheed Martin Flight Tests Direct RF Gen12 Transceiver on Group 2 Drone

Lockheed Martin in collaboration with Altera, an Intel Company, completed a successful flight demonstration of our 12th Generation Electronic Warfare (Gen12)...

Products

Electronics & Computers

New Products

See the new products, including EIZO Rugged Solutions' Condor™ NVA2102xX; Sealevel Systems' new family of computers, the Flexio Fanless Industrial Embedded Computers; Teledyne FLIR Defense's UltraFORCE® 380-HDc imaging system; the S-335 fast steering mirror from Physik Instrumente; Pixus Technologies' 3U and 6U handle/panel sets for OpenVPX and other architecture boards; and more.

Articles

Communications

Everyday Life, Improved by Light: GRYPHON’s Photonic Discoveries

GRYPHON will leverage recent developments in nonlinear photonics and photonic-electronic integration to develop microwave sources with noise performance that meets or exceeds that of the best discrete oscillator modules. Read on to learn more about the endeavor.

INSIDER

Defense

DARPA Selects Texas for Open-Access Semiconductor Microsystem Fabrication Facility

Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas...

INSIDER

Materials

Navy Scientists Discover New Class of Semiconductor Nanocrystals

U.S. Naval Research Laboratory (NRL) scientists confirm the identification of a new class of semiconductor nanocrystals with bright ground-state excitons, a significant...

Articles

Photonics/Optics

MEMS-Based Accelerometer to Measure Microgravity for In-Orbit Manufacturing

Looking ahead, the continued development of MEMS technology will likely unlock new possibilities for space exploration and utilization, ensuring that projects like ForgeStar remain at the forefront of scientific and technological progress. Read on to learn more.

Briefs

Test & Measurement

Streamlined Microcomb Design Provides Control With The Flip of a Switch

Researchers at the University of Rochester describe new microcomb lasers they have developed that overcome previous limitations and feature a simple design that could open the door to a broad range of uses. Read on to learn more.

Briefs

Aerospace

Researchers Demonstrate the First Chip-Based 3D Printer

Imagine a portable 3D printer you could hold in the palm of your hand. Researchers took a major step toward making this idea a reality by demonstrating the first chip-based 3D printer. The prototype chip has no moving parts, instead relying on an array of tiny optical antennas to steer a beam of light. Read on to learn more.

Products

Manufacturing & Prototyping

New Products

See the new products, including Durabook's major upgrade of its Z14I laptop; New Wave Design’s V6065, a next-generation heterogeneous embedded computing 3U VPX module; Teledyne FLIR's next generation of high-performance Hadron 640 dual radiometric thermal and visible camera modules; Pickering Interface’s new high channel count microwave MUX family; and more.

Articles

Manufacturing & Prototyping

How Intelligent Battery Management Drives EV Buyer Confidence

Battery management systems are poised to become a key competitive differentiator in an EV market that is seeking to grow and thrive on a global level. And by tapping into smarter BMS, automotive manufacturers are future-proofing their resources by embracing, even anticipating, trends in EV battery design. Read on to learn more.

Articles

Manufacturing & Prototyping

EV Energy Management Powers Up

Future electric vehicles will be more efficient, more powerful, and will be able to hold more energy in their batteries than today’s EVs. Those big “mores” require countless small improvements beyond the headline component — batteries. Read on to learn more.