Using SWaP-C Reductions to Improve UAS/UGV Mission Capabilities
The defense and aerospace market continues to push for reductions in size, weight, power, and cost (SWaP-C) to support advanced sensor/vetronics payloads onboard unmanned platforms. Groundbreaking SWaP-C reduction for processor and network switch systems are enabling UAS (unmanned aircraft system) and UGV (unmanned ground vehicle) platforms to expand their mission capabilities. Several technologies are driving this small form factor revolution, including tightly integrated system- on-chips (SoCs), semiconductor packaging advancements (i.e. smaller nanometer dies, lower voltage chips), and micro-miniature rugged connectors.
The platforms might also include onboard sensors used to remotely control the aircraft or vehicle, or to allow autonomous operation of the platform. This requires that various processing elements and various sensors are interconnected to gather information. Typically, if there are multiple processors on the platform they will be supported with a data communications network, which is driving the need for smaller processor and network switch connectivity. At the same time, system designers want devices that meet the requirements, from an environmental and EMI standpoint, to operate in harsh environments such as at high altitude or during water ingress. Other notable reliability concerns that need to be mitigated include dealing with “dirty power” that might otherwise damage devices due to high voltage surges or spikes, and also noisy electrical environments aboard the vehicle that may disrupt adjacent devices.
One key contributor is fuel. There’s a tradeoff analysis of how much capability a platform can provide given a specified weight for the electronics, fuel, and ammunition, etc. If one element is removed you can add more of another. But if you can shrink the physical size and weight of the payload electronics you can potentially get more functionality in the same physical space.
Switch Sizing
As an example, a couple of years ago, one of the largest US Army tactical UAS platforms had a requirement for network readiness, involving the integration of an onboard Gigabit Ethernet network. Given that the UAS was a smaller platform, the customer performed a volumetric analysis and determined that the size available for the network switch was roughly the size of a pack of playing cards, and ideally about half a pound in weight.
At the time, when the requirement arose, we had a COTS Ethernet switch that met the functional requirement but exceeded the allowable weight. We had already developed a roadmap for a miniaturized version of the switch and we accelerated the timing to accommodate this program. As a result, we designed, without NRE, a COTS solution that was half a pound in weight and just 10 cubic inches in size. This was 10% of the weight and size of our smallest previous GbE switch product.
Beyond the miniaturization provided by the SoC, you need to consider the physical packaging of the system, including the metal, the connectors, and the thermal needs of the device. As manufacturers of these next generation SoC devices are reducing the thermal needs of the silicon, they are producing devices that are lower power and, therefore, the system requires less power dissipation in terms of the surface area of the system enclosure. Enclosures can now be smaller and still dissipate the heat that is generated by the device.
Connectors and Computers
The connectors that bring out all the I/O signals for the Ethernet and other computer I/O have also advanced in recent years. The traditional MIL-DTL-38999 connectors are still widely used and accepted. However, next generation micro-miniature versions of the connector are now available that provide the same or better physical, EMI, and electrical performance. These have higher density contacts and the physical size and weight of the connectors are roughly half that of traditional options. Traditional 38999 shell sizes, together with MIL-STD-1472 Human Engineering recommendations for connector spacing, has driven the size of the connector panel and enclosure. With the new micro-miniature connectors, we are able to shrink the physical height of the box. In the case of our miniature GbE Ethernet system, the box is now barely over an inch tall.
Another example of a small form factor component suitable for unmanned vehicles is the recently introduced Parvus DuraCOR 310 tactical mission computer based on a low-power, fourcore NXP i.MX6Quad ARM processor. This ultra-small system measures less than 40 cubic inches in volume, weighs less than 1.5 lbs and requires only 10 watts of power. It supports a high level of I/O flexibility through the use of dual PCIe-Mini Card I/O expansion slots. The mission computer features an industrial grade ARM-based Computeron-Module (COM) tightly integrated with a Flash SSD and system carrier board, which provides a full complement of standard vetronics I/O interfaces including CANbus, USB, Ethernet, serial, DIO, video, and audio. The system’s combination of small size, low-power multi-core processing, and flexible I/O represents the key design targets that system designers for unmanned systems are seeking to be able to add new Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR) capabilities to their platforms.
The breakthroughs in SWaP-C reduction resulting from continued increases in device density, packaging improvements and connector size miniaturization will help drive the development of smaller, more effective unmanned platforms. As these platforms expand their mission capabilities, our warfighters will benefit from better, more real-time intelligence.
This article was written by Mike Southworth, Product Marketing Manager, Curtiss-Wright Defense Solutions (Ashburn, VA). For more information, Click Here .
Top Stories
INSIDERAerospace
Clean Sky Demonstrator Fuselage Shows Potential of Thermoplastics in Aircraft...
INSIDERAerospace
Blue Origin Rocket Reaches Intended Orbit on First Launch
INSIDERAerospace
Can Microvanes Improve Fuel Efficiency for Legacy Air Force Aircraft?
NewsConnectivity
Closing Gap to Leverage Enhanced Computational Power for SDV Advancement
INSIDERSoftware
The Future of Aerospace: Embracing Digital Transformation and Emerging...
INSIDERAerospace
Researchers Achieve Breakthrough in New Design of Superconducting Quantum...
Webcasts
Defense
Improving Thermal Management for Aerospace and Defense Electronics
Connectivity
The Road Ahead for Next-Gen E/E Architectures: Trends and...
Electronics & Computers
Department of Defense Contracts Denied: New Cybersecurity Rules...
Software
Leveraging Simulation for Net Zero Emissions in Conventional and...
Automotive
Quickly Prototyping Custom Textures on Automotive Parts
Automotive
AI-Powered Quality Control for Sustainable Automotive Production