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Highly Integrated Core Chip

The XZ1001-BD is a highly integrated transmit/receive 4 port core chip from M/A-COM Tech Asia (Hsinchu, Taiwan). It is designed for applications operating within the 2.5 to 4 GHz range. The XZ1001-BD features 100% Visual Inspection to MIL-STD-883 Method 2010. The core consists of integrated transmit/receive switches, LNA, 6-bit phase shifter, 6-bit attenuator, and driver amplifier.

The digital control logic allows fast phase shifter and attenuator changes. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. The device is well-suited for phased array radar applications. Channel temperature affects a device's MTTF.

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Topics:
Defense

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