New Products

December 1, 2023

SuperFlash® Embedded Flash Memory

GlobalFoundries (GF®) and Microchip Technology (Chandler, AZ), via Microchip’s Silicon Storage Technology® (SST®) subsidiary, announced the immediate release to production of the SST ESF3 third-generation embedded SuperFlash technology NVM solution in the GF 28SLPe foundry process. Use cases for embedded flash are exploding with the drive for increased intelligence at the edge. Embedded memory for secure code storage, over-the-air-updates and enhanced functionality is on the rise in a wide range of applications in home and industrial IoT as well as smart mobile devices. Innovative platforms are required to meet these needs.

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Spider Rugged Thunderbolt Display

General Micro Systems (GMS) (Rancho Cucamonga, CA) announced a new rugged display using open-standard Thunderbolt™ 4 technology. The X9 Spider Rugged Thunderbolt Display, the market’s lightest 1-inch thin, mobile-ready multi-function touchscreen display, is available today in 12-, 17-, 24- or 36-inch sizes, in standard and high-definition resolution. Using Thunderbolt 4 technology developed by Apple® and Intel® allows the display to be connected by an exceptionally thin single copper or fiber optic cable up to 50 m, which also powers the display and all its features.

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Wideband IF Vector Signal Generator

To support pioneering mmWave and sub-THz research, Rohde & Schwarz (Munich, Germany) continues to roll out advanced RF test and measurement solutions. Three additional products tailored to W and D band applications were showcased at the EuMW 2023 in Berlin: The new R&S SFI100A wideband IF vector signal generator, the R&S NRP170TWG thermal power sensor and the R&S FE110ST/SR TX/RX frontends. All three enable researchers to characterize devices and circuits for beyond 5G and 6G mobile communications as well as the novel sensing and automotive radar applications of tomorrow.

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GaN Power Amplifier MMIC

mmTron (Redwood, CA) has developed the highest efficiency class AB GaN power amplifier (PA) MMIC for the 17.3 to 21.2 GHz satellite downlink band: The TMC261 covers the band with margin and provides 1.1 watts of output power with 35 percent power-added efficiency (PAE) at a noise power ratio (NPR) of 13 dB. “High data rate communications satellites require PAs with very high linearity and high efficiency — two parameters that are difficult to achieve simultaneously,” said Seyed Tabatabaei, mmTron’s CEO. “Our engineers designed this PA to achieve both, aiming to set a new standard for satellite applications. We’ve already received an order from the largest European satellite payload manufacturer to evaluate the TMC261 for a low Earth orbit (LEO) satellite constellation.”

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Fill Bond Flex Aerospace Filler

Sherwin-Williams Aerospace Coatings (Andover, KS) launched Fill Bond Flex Aerospace Filler (FBF100) as a new, convenient method for filling seams, rivets and small spot repair areas on aircraft prior to painting. The high-quality, two-component polyester filler kit is designed to block, and permanently conceal, surface imperfections on composite exterior aircraft surfaces. The lightweight filler provides performance, versatility and productivity by offering strong adhesion, resistance of shrinkage, sandability, flexibility and stain resistance, making it ideal for creating smooth surfaces for topcoat applications.

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Space-Qualified FPGA Processing Board

Mercury Systems, Inc. (Andover, MA) introduced the first space-qualified FPGA processing board to use AMD’s Xilinx Versal® AI core. The SCFE6933 is a radiation-tolerant, 6U SpaceVPX board that will make high-performance computing more accessible for a broad range of space applications and customers. Mercury’s SCFE6933 allows data to be processed on orbit faster, more efficiently, and more reliably. Optimized for size, weight, and power, the SCFE6933 performs in a single board what previously required three boards, simplifying mission architectures, and reducing costs.

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SBC3902 Single Board Computer

AMETEK Abaco Systems (Huntsville, AL) new SBC3902 single board computer (SBC) is designed with the world’s most powerful AI Edge computer, melding autonomous and embedded Edge Computing systems and real-time GPU processing in a small 3U VPX form factor. Aligned with Sensor Open System Architecture (SOSA™) slot profile 14.2.16, the 3U VPX IO Intensive computing card offers the NVIDIA® Jetson AGX Orin™ module, delivering up to 275 TOPS of AI performance. The Jetson AGX Orin GPU includes 2048 NVIDIA CUDA® cores and 64 Tensor Cores, as well as DL and vision accelerators.

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RF and EMI Shielded Enclosures

At Select Fabricators (Victor, NY), it is our goal to supply our customers with the highest RF attenuating Shielded Enclosures. While we understand the importance of reliable and effective shielding against radio frequency (RF) and electromagnetic interference (EMI) we also understand that, for some customers, a rapid fast deployment is also a key issue. While the 100 series aluminum frame can deploy in 10-15 minutes, sometimes that time isn’t available. We listened, and as of recent, we are answering with our latest offering: a more lightweight version of our popular shielded enclosures – Select Fabricators’ Series 700 Inflatable RF Shielded Tents.

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Airborne 8-Port Gigabit Network Switch

Curtiss-Wright’s Defense Solutions Division (Ashburn, VA) introduced the industry’s first rugged airborne Gigabit network switch designed specifically to meet the unique demands of flight test applications. The new NSW-8GT-TGE-1 is a rugged 8-port non-blocking Gigabit Ethernet switch that provides full IRIG-106 Chapter 21-28 Telemetry Network Standard (TmNS) compliance, including MDL programming. TmNS provides a powerful new tool for the flight test telemetry industry.

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Phased Array Antenna Control and Calibration

Keysight Technologies, Inc. (Santa Rosa, CA) introduces the new Phased Array Antenna Control and Calibration solution, a breakthrough over-the-air (OTA) calibration and characterization solution that enables satellite designers developing active electronically scanned arrays for satellite communications applications to rapidly test their designs during early validation. Modern satellite networks operate at higher frequencies and use active phased array antenna systems which are driving ubiquitous connectivity and sensing requirements of next-generation satellite communication.

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Hypersonic Sapphire Windows

Custom fabricated sapphire windows that are ideally suited for protecting sensitive vison systems and sensors in hypersonic aircraft and weapon systems have been introduced by Meller Optics, Inc. (Providence, RI). Meller Flat Sapphire Windows feature Mohs 9 hardness, which is second only to diamond, and can withstand temps. up to 1,000 °C, pressures to 10,000 psi, and are chemically inert, impervious to water, and extremely abrasion resistant. Ideal for protecting vison systems and sensors in hypersonic aircraft and weapon systems, these windows transmit from the UV to IR.

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MIL-PRF-55342-Compliant Fixed Attenuators

Smiths Interconnect (Sudbury, MA) announces the launch of a new series of fixed attenuators and Thermopad® products. The patented products, which are part of Smiths Interconnect’s innovative SPL series, provide heightened performance for use in space, defense, and aerospace applications. They are ideal in applications requiring stringent performance requirements and are highly reliable based on Smiths qualified reliability process.

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ADC Digitizer Cards

Spectrum Instrumentation (Grosshansdorf, Germany) has extended the M5i flagship series of high-speed PCIe digitizers, adding two new models with ultrawide bandwidths that go up to 4.7 GHz for -3 dB attenuation or even 5 GHz for -5 dB attenuation. The models M5i.3360-×16 and M5i.3367-×16 provide one and two channels respectively. Each card is capable of sampling at rates up to 10 GS/s, with 12-bit vertical resolution, specifically designed to deliver the most accurate acquisition and analysis of signals in the GHz range.

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DC to 90 GHz Connectors

Samtec (New Albany, IN) has fully released its line of vertical solderless, compression mount connectors that incorporate precision alignment features. Spanning DC to 90 GHz, the new connectors are well suited for use in high-frequency test and measurement applications and are available in full production quantities. The connectors come standard with precision alignment features that are exclusive to Samtec and ensure peak connector performance.

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VITA 67 Cable Assemblies

Fairview Microwave (Irvine, CA) and a leading provider of on-demand RF, microwave and millimeter-wave components, has announced the rollout of VITA 67 mini-SMP (SMPM) cable assemblies. They are designed to address the critical needs of industries such as aerospace and defense, ground communication systems, radar systems and avionics. One of the standout features of the VITA 67 cable assemblies is their impressive DC to 65 GHz frequency range, setting a new industry standard for signal transmission.

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