Rugged Electronic Enclosures
Carlo Gavazzi Computing Solutions, Brockton, MA, announces the 709 Series of air-cooled rugged electronic enclosures for computer cards in the harsh environments of shipboard and land-based military applications. The 709 Series is configured for flexibility, accommodating up to 20 slots for VME64, VME64x, VXS, VPX, VXI, or CompactPCI cards and ranging in size from 8U to 15U high and 20.5" deep. The series is available in AC/DC or multiple-outlet power configurations of up to 2000W, and can also be configured in three different ways: pressurized, evacuation, or combination push/pull.
The EIA rack-mountable enclosures feature either overlapping or welded construction and are engineered to meet military specifications for shock and vibration. Due to advanced air filtration, cards are impervious to harsh environment contaminants. The enclosures are designed to meet MIL-STD-901, MIL-STD-810, MIL-STD-167, MIL-STD-704, and MIL-STD-461 standards. The 709 Series can be optionally configured to include an internal card cage shock isolation system and meet drip-proof and splash-proof requirements. The chassis can also be outfitted with shock-isolated peripheral bays.
For Free Info Click Here
Top Stories
INSIDERDefense
F-35 Proves Nuke Drop Performance in Stockpile Flight Testing
INSIDERMaterials
Using Ultrabright X-Rays to Test Materials for Ultrafast Aircraft
INSIDERManufacturing & Prototyping
Stevens Researchers Test Morkovin's Hypothesis for Major Hypersonic Flight...
INSIDERManufacturing & Prototyping
New 3D-Printable Nanocomposite Prevents Overheating in Military Electronics
INSIDERRF & Microwave Electronics
L3Harris Starts Low Rate Production Of New F-16 Viper Shield
INSIDERRF & Microwave Electronics
Webcasts
Energy
SAE Automotive Engineering Podcast: Additive Manufacturing
Manufacturing & Prototyping
A New Approach to Manufacturing Machine Connectivity for the Air Force
Automotive
Optimizing Production Processes with the Virtual Twin
Power
EV and Battery Thermal Management Strategies
Energy
How Packet Digital Is Scaling Domestic Drone Battery Manufacturing
Materials
Advancements in Zinc Die Casting Technology & Alloys for Next-Generation...



