Low-Thermal-Expansion Epoxy

August 13, 2015

Ryan Gehm

EpoxySet Inc. has released the EB-315 low-thermal-expansion epoxy as part of its line of low-expansion/thermally conductive products. The versatile material can be used as an adhesive or encapsulant for semiconductors and other microelectronics, a gasket sealing compound, wire bonder, or for any application where temperature cycling between -55 and +230°C (-67 and +446°F) is required. The coefficient of thermal expansion is under 25 ppm/°C with a glass transition temperature of 182°C (360°F), making it suitable for low stress applications bonding fragile parts. EB-315 is resistant to most chemicals so it can be used in a range of environmental conditions. Modified versions can be offered to meet the most demanding applications. EpoxySet is a custom formulator of epoxies, urethanes, silicones, and greases for the electronic, semiconductor, automotive, and aerospace industries.