Test Socket Thermal Solutions

October 1, 2015

Aries Electronics (Bristol, PA) recently introduced a new thermal profiling solution for its test and burn-in socket line of products. Unlike standard heat-sink and fan options, this solution incorporates advanced thermal profiling software to develop an application/IC specific thermal analysis for each customer’s requirement(s).

The software will analyze all of the necessary parameters within the socket/IC/test environment and determine the correct heat sink/fan/cooling combination necessary to optimize the test and burn-in application, enabling the socket to be thermally correct before it is placed into its final environment. New thermal profiles are initiated using an online fill-in .pdf form linked from all of Aries’ test and burn-in socket pages.

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