New 3D-Printable Nanocomposite Prevents Overheating in Military Electronics

December 8, 2025

Army and university researchers collaborated to develop a 3D printable nanocomposite material comprising hexagonal boron nitride (hBN) fillers embedded in a thermoplastic polymer that exhibits high thermal conductivity, low electrical conductivity and radio frequency (RF) transparency. (Photo Credit: Matthew Modoono, Northeastern University)

U.S. Army and university researchers collaborated to develop a 3D-printable material using tiny particles that conduct heat and can be used to more efficiently cool military advanced electronics. The technology is ready for industry engagement and commercialization.

The advanced material, a research effort between Northeastern University and U.S. Army Combat Capabilities Development Command, or DEVCOM, Army Research Laboratory, has the potential to advance warfighter capabilities. Thermal management and packaging of high-power electronics in communication systems, radar, drones and electric vehicles are some of the technologies it could improve. These systems currently can suffer from degraded performance, or even shut down when they overheat, which is a growing challenge for the Army.

Through careful formulation and processing, the novel polymer nanocomposite contains a unique combination of thermally conductive platelets and crystallized polymer that enables its extraordinary properties. (Photo Credit: Dan Bracconier, Northeastern University)

“This advanced material is a significant step forward for packaging of advanced electronics,” said Dr. Eric Wetzel, Mechanical Engineer at DEVCOM ARL and the paper’s co-author. “Its ability to efficiently manage heat while maintaining RF transparency, while also being 3D printable, enables new possibilities for military and industry applications.”

Published in Advanced Materials , the research uses a nanocomposite material comprising inorganic, hexagonal boron nitride (hBN) fillers embedded in a thermoplastic polymer. By carefully combining additives, surface treatments and thermal post-processing, the team created a crystalline polymer structure that bridges the highly conductive fillers, significantly enhancing thermal conductivity.

The nanocomposite is first formed into continuous filament, which can then be fed into a desktop 3D printer to create complex structures such as heat sinks, thermal spreaders, mounting plates or panel covers. The 3D printing process further aligns the fillers, boosting the material’s performance. Unlike metal packaging, this hBN nanocomposite is both RF transparent and electrically insulating, so it can be placed in close proximity to high-current and high-voltage electronics without blocking RF signals — critical to communications or radar systems — or risking an electrical short.

The material is also lightweight, about 40 percent less dense than aluminum and 80 percent less dense than copper, two of the most widely used materials for advanced thermal management of electronics.

This material could enable the development of lighter, more compact and more efficient electronic assemblies for use in harsh environments, which could lead to improved Soldier survivability and mobility.

“We are looking for industry partners to transition this technology,” Wetzel said. “In additional to military applications, we see a wide range of commercial applications for this material, including personal electronics such as mobile phones, telecommunications equipment, data centers and electric vehicles.”

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