MOBILITY ENGINEERING Produced by SAE Media Group
MOBILITY ENGINEERING
Magazines
Magazine cover

Current Issue

Archives

Magazine cover

Current Issue

Archives

Magazine cover

Current Issue

Archives

Magazine cover

Current Issue

Archives

All-Diamond Packaging Solution

In collaboration with the University of Warwick, Element Six (Santa Clara, CA) has developed an all-diamond sensor structure for electroanalytical applications. The synthetic electrode is available in a variety of geometries encapsulated in co-planar insulating diamond. Element Six’s Diafilm EA-grade electrode material features 100 percent phase purity, and the electrode presents a typical surface roughness of Ra<0.02 μm. Precisely controlled boron concentrations provide metal-like ohmic conductivity while achieving low capacitance.

For Free Info Click Here 

Topics:
Aerospace Defense

More From SAE Media Group

    Magazine cover
    Aerospace & Defense Technology Magazine

    This article first appeared in the October, 2014 issue of Aerospace & Defense Technology Magazine (Vol. 38 No. 10).

    Read more articles from this issue here.

    Read more articles from the archives here.

    Top Stories

    INSIDERRF & Microwave Electronics

    Feature Image FAA to Replace Aging Network of Ground-Based Radars

    PodcastsDefense

    Feature Image A New Additive Manufacturing Accelerator for the U.S. Navy in Guam

    NewsSoftware

    Feature Image Rewriting the Engineer’s Playbook: What OEMs Must Do to Spin the AI Flywheel

    Road ReadyPower

    Feature Image 2026 Toyota RAV4 Review: All Hybrid, All the Time

    INSIDERDefense

    Feature Image F-22 Pilot Controls Drone With Tablet

    INSIDERRF & Microwave Electronics

    Feature Image L3Harris Starts Low Rate Production Of New F-16 Viper Shield

    Webcasts