New Products

April 1, 2025

High Power Narrow Linewidth External Cavity Laser

SemiNex (Danver, MA) announced the launch of the narrow-linewidth high-power External Cavity Laser (ECL) with single frequency that can achieve >200 mW output power and 10 kHz Lorentzian linewidth in C or O-band. Such high performance is essential to optical networks, FMCW LiDAR, aerospace, and industrial sensing applications. With SemiNex’ Gain Chip and high-power SOA integrated with a Photonic Integrated Circuit (PIC) forming an external cavity, a narrow linewidth and high optical power laser is achieved. Both C & O-band operating wavelength ranges are available, and a custom center wavelength can be requested.

Visit Here

Broadband Amplifiers

Rohde & Schwarz (Munich, Germany) has extended its proven R&S^®BBA300 portfolio with two innovative amplifier series, the R&S^®BBA300-F which covers 6 to 13 GHz, and the R&S^®BBA300-FG covering 6 to 18 GHz. The R&S^®BBA300 family is a new generation of compact, solid-state broadband amplifiers, designed for high availability and a linear output across an ultra-wide frequency range. It supports amplitude, frequency, phase, pulse and complex OFDM (orthogonal frequency division multiplexing) modulation modes. It is also extremely robust under all mismatch conditions, providing valid test results in all circumstances.

Visit Here

UAS Autonomous Software

Teledyne FLIR (Goleta, CA) announced the release of Prism™ Supervisor, the latest addition to its Prism embedded software ecosystem. Prism Supervisor integrates drone autopilot flight control systems with real-time, AI-based observations at the edge to improve mission safety, efficiency, and performance, enhancing the capabilities of unmanned aircraft systems (UAS). Prism Supervisor software empowers mission planners with a flexible programming framework and software development kit (SDK) to facilitate custom, intricate mission scenarios. During flight, Prism Supervisor adapts its autopilot functionality in real-time, dynamically generating mission segments and flight plans on the fly.

Visit Here

CMOSS/SOSA Development Backplane

Pixus Technologies (Waterloo, Ontario) announced a new C5ISR Modular Suite of Standards (CMOSS) and SOSA development backplane that supports various I/O intensive, compute intensive, switches, PNT slots, and VITA 62 PSU slots. The 8-slot development backplane only has the utility plane routed (including power, ground, SMbus, clock, and utility signals). This allows a versatile range of plug-in card configurations to be utilized. Three of the slots have a cutouts for VITA 67.3c interfaces and one slot has a VITA 67.3d cutout.

Visit Here

PCIe/104 Carrier Cards

Acromag (Wixom, MI) now offers the Model APX4020 carrier cards to integrate their family of AcroPack I/O mezzanine modules into PC/104 computing systems. Available in PCIe/104 and PCI/104-Express formats, both versions provide two mezzanine module sites capable of hosting AcroPack or full-size PCIe mini cards. AcroPack modules offer a broad range of signal processing functions including analog and discrete I/O, serial communication, avionics, and FPGA computing. Dual 50-pin connectors simplify the I/O interface between the modules and field signals without any loose internal wires. Designed for rugged applications, AcroPacks are well-suited for use in defense, aerospace, and industrial applications where size, weight, and power (SWaP) optimization is required.

Visit Here

OpenVPX Backplanes

Elma Electronic (Fremont, CA) has enhanced its line of SOSA aligned backplanes to include a 7-slot 3U OpenVPX model that further supports the DOD’s Modular Open Systems Approach (MOSA) mandate. Complete with six VITA 65 slots and one VITA 62 PSU slot, the new backplane helps facilitate the development of a common architecture across critical C5ISR and EW systems. Specific application functions include mission, weapons or navigation control, surveillance, as well as threat detection and processes or environmental monitoring. All control and data plane links are designed for 25 Gbps data rates for high-speed signaling on all data paths and support dual domain Ethernet up to 100GBASE-KR4.

Visit Here

HDMI 2.0 AOC Cable

Amphenol (Wallingford, CT) launched the HDMI 2.0 Active Optical Cable (AOC) solution, designed to redefine the transmission of high-definition audio and video signals over long distances. This hybrid cable, combining fiber optics and copper, extends the HDMI signal by up to 100 meters, while maintaining impeccable, latency-free quality. With this innovative solution, we eliminate the constraints of conventional HDMI cables, which are often limited to a few meters before suffering signal loss. Our HDMI AOC solution, which is easy to install and requires no external power supply, meets the requirements of defense environments, where reliability and performance are paramount.

Visit Here

SOSA Aligned FPGA Module

Curtiss-Wright’s Defense Solutions Division (Ashburn, VA) has announced the market’s highest performance SOSA aligned 3U VPX FPGA plug-in-card (PIC) module, the VPX3-536 Adaptable Processor. The VPX3-536, the newest addition to Curtiss-Wright’s comprehensive and industry leading Fabric100™ ecosystem of 100 Gigabit Ethernet (GbE)/PCIe Gen 4 system modules, uniquely combines an AI-enabled accelerated compute architecture, dual 400G high-speed crypto engines, and up to 28 high-speed backplane fiber optic links.

Visit Here

RoboRack Half Rack Cases

Through hell, highwater, and invisible electromagnetic waves that toil with valuable electronic assets – military, aerospace, healthcare, and many other industries, can now turn to the new GemShield RF™ EMI-Shielded case to safely transport sensitive electronics. RoboRack ^{^®} Half Rack Cases, manufactured by Gemstar Manufacturing (Cannon Falls, MN), now come with the option to include the GemShield RF EMI Shielding Liner by V Technical Textiles, Inc. (VTT). The case is ideal for transporting sensitive electronics and maintaining data integrity.

Visit Here

Wi-Fi 6 Coprocessor Modules

STMicroelectronics (Geneva, Switzerland) has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications. The collaboration aims to deliver initially IoT modules leveraging ST’s powerful STM32 ecosystem and Qualcomm Technologies’ leading wireless connectivity solutions. The first of these modules, the ST67W611M1, contains a Qualcomm^® QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo, made easy to integrate with any STM32 microcontroller (MCU) or microprocessor (MPU).

Visit Here

Chip Scale Atomic Clock

Microchip Technology (Chandler, AZ) announced its second generation Low-Noise Chip-Scale Atomic Clock (LN-CSAC), model SA65-LN, in a lower profile height and designed to operate in a wider temperature range, enabling low phase noise and atomic clock stability in demanding conditions. Microchip has developed its own Evacuated Miniature Crystal Oscillator technology and integrated it into a CSAC, enabling the model SA65-LN to offer a reduced profile height of ½ inch, while maintaining a power consumption of < 295 mW. The new design is optimal for aerospace and defense mission-critical applications such as mobile radar, dismounted radios, dismounted IED jamming systems, autonomous sensor networks and unmanned vehicles.

Visit Here

UHF Band Power Divider

BroadWave Technologies (Greenwood, IN) has developed a 50 Ohm UHF band power divider to support commercial wireless communications, defense, homeland security, and public safety systems. Model 151-308-008 is an 8-way power divider with SMA female connectors. This device operates from 500 to 3000 MHz and exhibits typical isolation of 25 dB. Nominal insertion loss above theoretical split at 3000 MHz is 1.5 dB and maximum VSWR is 1.50:1 In addition to power dividers with SMA female connectors we also offer power divider with BNC, N, and TNC connectors.

Visit Here

Multipath Radio Platform

Comtech Telecommunications Corp. (Chandler, AZ) announced the launch of their new multipath radio (“MPR”) platform. As the first-ever terrestrial high data rate over-the-horizon integrated radio of its kind, MPR will empower first responders, warfighters, and commercial operators with new high data rate communications capabilities on a single antenna agnostic platform. Built on the proven success of Comtech’s next-generation Troposcatter systems, the MPR platform’s multimode functionality, diverse antenna support, and advanced signal processing techniques empower users to establish secure, reliable and resilient communications links in challenging environments where traditional radios struggle.

Visit Here

Wideband 50 GHz RF Switch

Teledyne HiRel Semiconductors (Milpitas, CA) announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T. This switch operates from true DC to 50 GHz, delivering excellent RF performance down to zero Hertz, making this device ideal for many of today’s complex space and defense applications. It has been developed in a 150nm pseudomorphic High Electron Mobility Transistor (pHEMT) Indium Gallium Arsenide (InGaAs) process and is available in a 1.15 mm × 1.47 mm × 0.1 mm die ideal for hybrid assembly products. It is qualified to an extended temperature range of –40 ⁰C to 85 ⁰C per MIL-PRF-38534 Class K equivalency for space applications and is available for immediate shipment.

Visit Here