Copper Via Process for Thin Film Substrates

April 1, 2013

UltraSource, Inc. (Hollis, NH), a supplier of custom thin film circuits and ceramic interconnect devices, has announced the new CopperViaTM, based on their existing patented UltraVia process. The CopperViaTM process fills vias with pure copper material in order to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraViaTM, the CopperViaTM virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

Solid filled vias provide a low inductance, microwave grounding path, allowing high performance RF circuits to be assembled in a thermally efficient surface mount configuration. The CopperVia enables a lower cost thin film structure than using other precious metals for making a signal or power interconnect between the planar layers of high frequency circuits and meets the reliability requirements for harsh environment applications such as defense and security systems, fiber optic transceivers, infrared detection, radar, and medical applications.