New Products
XMC Video Capture and GPGPU Card
EIZO Rugged Solutions Inc. (Orlando, FL) released the Condor™ NVA2102xX – a rugged XMC form-factor video graphics card designed for high-performance embedded computing applications that require real-time video/sensor capture and AI-accelerated GPGPU processing. The Condor NVA2102xX card enables systems to simultaneously capture, process, display, encode, decode, and stream video data in a single XMC slot. The new XMC card features four 3G-SDI video inputs and four Display-Port++, VGA, and 3G-SDI outputs. It is designed with the NVIDIA RTX™ A2000 GPU, which supports 8 GB of GDDR6 graphics memory with error correction code (ECC), 2,560 CUDA® cores, 80 Tensor Cores and 20 RT Cores, for accelerated performance in neural network training and inferencing functions.
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Fanless Industrial Computers
Sealevel Systems (Liberty, SC) announces a new family of computers, the Flexio Fanless Industrial Embedded Computers. Fueled by a Quad-core Intel Atom or Core processor, Flexio computers are intentionally designed to provide power, connectivity, and performance. With support for DIN rail or VESA mounting, the Flexio Fanless Industrial Embedded Computer is designed for easy installation in existing frameworks and for new system integrations as well. The Flexio features a solid-state design for an extended lifespan, diminished opportunities for failure, and quiet operation.
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Long Range Airborne Imaging System
Teledyne FLIR Defense (Boston, MA) unveiled its UltraFORCE® 380-HDc imaging system at the Farnborough International Air Show. The new long-range airborne surveillance solution is not subject to International Traffic in Arms Regulations (ITAR), easing shipment and freedom of movement to customers outside the United States. The UltraFORCE 380-HDc delivers superior high-definition multi-spectral imaging in a compact, low-profile package. Full 1080p resolution across its visual, thermal, low-light, and shortwave infrared (SWIR) cameras makes the 380-HDc an optimal solution for airborne reconnaissance, patrol, and search and rescue missions.
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Two-Axis Fast Steering Mirror
The S-335 fast steering mirror (FSM) from Physik Instrumente (Auburn, MA) provides fast and high-resolution motion in two degrees of freedom. Based on solid-state piezo drives, it is well-suited for precise, high-speed laser beam control and high-resolution imaging applications. The S-335’s long angular travel range is made possible by a clever design using motion-amplified piezo actuators, operated in a differential push-pull mode for each axis. Closed-loop control with feedback sensors provides excellent repeatability and accuracy.
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3U and 6U Handle/Panel Sets
Pixus Technologies (Waterloo, Canada) offers new 3U and 6U handle/panel sets for OpenVPX and other architecture boards. The Pixus Slimline Type X handle/panel sets come in a 1.0” slot pitch standard but special panel sizes are optional upon request. The all metal handles are ideal for the high insertion forces of OpenVPX. With a thin 4.05mm wide level, the design maximizes the amount of panel space available while providing excellent leverage for easier board insertion/removal.
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Space Grade SoC Power and Monitoring
Renesas Electronics Corporation (Tokyo, Japan) announced a complete space-ready reference design for the AMD Versal™ AI Edge XQRVE2302 Adaptive SOC. Developed in collaboration with AMD, the ISLVERSALDEMO3Z power management reference design integrates key space-grade components for power management. It targets the cost-effective AI Edge with both rad-hard & rad-tolerant plastic solutions specifically designed to support a wide range of power rails for next-generation space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion.
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CoolGaN™ Transistor
Infineon Technologies AG (Munich, Germany) announced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN TM devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40 V to 700 V in a broader array of applications. The new 650 V G5 family addresses applications in consumer, data center, industrial and solar. These products are the next generation of GIT-based high voltage products from Infineon. The second new family manufactured on the 8-inch process is the medium voltage G3 devices which include CoolGaN Transistor voltage classes 60 V, 80 V, 100 V and 120 V; and 40 V bidirectional switch (BDS) devices. The medium voltage G3 products are targeted at motor drive, telecom, data center, solar and consumer applications.
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HSR 100 Rack Mount
Curtiss-Wright’s Defense Solutions (Ashburn, VA) has announced the newest member of its deployable data storage product family, the HSR100 Rackmount supports two 100 gigabit Ethernet (GbE) ports that provides secure data-at-rest (DAR) storage and recording unit. This high-capacity network attached storage (NAS) device is packaged in a 1U rackmount form factor. The HSR100 Rackmount supports both National Security Agency (NSA) Type 1 and Commercial Solutions for Classified (CSfC) two-level encryption.
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Ultrashort Pulse Laser
Luxinar’s (Kingston Upon Hall, UK) LXR® ultrashort pulse laser platform isn’t just about shrinking existing technologies. It empowers the creation of entirely new micro-components, propelling advancements far beyond our current imagination. Imagine intricate microfluidic channels with minimal flow resistance, enabling groundbreaking breakthroughs in medical diagnostics and drug delivery. Picture next-generation batteries with enhanced energy density and faster charging times, thanks to revolutionary microfabricated components. This is the future that the LXR® unlocks, a future where miniaturization fuels groundbreaking advancements across diverse sectors.
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Low Capacitance TVS Diode Series
Littelfuse Inc. (Chicago, IL) announced the release of the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series. This groundbreaking series of TVS diodes is designed to safeguard avionics equipment from lightning and other overvoltage threats, setting a new standard in high-reliability protection for the aviation industry. The SMBLCE-HR/ HRA (600 W), SMCLCE-HR/HRA (1500 W), and SMDLCE-HR/HRA (3000 W) series stand out for their unique combination of high reliability and low capacitance in compact JEDEC DO-214AA and DO-214AB packages.
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Non-Drip Epoxy
Master Bond’s new (Hackensack, NJ) EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was successfully tested in chemicals such as 98 percent sulfuric acid, 25 percent hydrochloric acid, 20 percent phosphoric acid, and 15 percent nitric acid, by soaking cured samples for more than 12 months,” says Senior Product Engineer Rohit Ramnath. “The product also passes the damp heat reliability testing by withstanding 1,000 hours of 85 °C and 85 percent Relative Humidity (RH).” Although EP21ARHTND-2 is capable of curing at room temperature, to optimize its acid resistance properties, a cure schedule of overnight at ambient temperatures, followed by a heat cure of 150-200 °F for 2-4 hours or longer is typically recommended, and is serviceable from -60 °F to +400 °F.
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Rugged GPGPU AI Computer
Aitech Systems (Chatsworth, CA) has released the A178-AV, the latest iteration of its smallest rugged GPGPU AI supercomputers available with the powerful NVIDIA Jetson AGX Xavier System-on-Module. With its compact size, the A178-AV is the most advanced solution for AI, deep learning, and video and signal processing for the next generation of avionic platforms. Its Volta GPU with 512 CUDA cores and 64 Tensor cores reaches 32 TOPS INT8 and 11 TFLOPS FP16 at a remarkable level of energy efficiency, providing all the power needed for AI-based local processing where needed, next to the sensors. The A178-AV also features two dedicated NVIDIA engines providing an interface for deep learning applications.
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Electrical Structural Tester
Keysight Technologies, Inc. (Santa Rosa, CA) introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components. The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.
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TrueView 720 LiDAR
GeoCue (Madison, AL) and Xer Technologies AG, a Swiss manufacturer of hybrid-electric drones, have successfully integrated GeoCue’s TrueView 720 LiDAR and imagery sensor with the Xer X8 UAV platform. This collaboration marks a significant advancement in scalable long-range LiDAR and imagery drone mapping technology. The combination of the long-range, heavy-payload Xer X8 and the GeoCue TrueView 720 enhances aerial operations, enabling high-quality point cloud and imagery data collection over vast and challenging terrains. The integration significantly improves the aerial mapping and inspection workflow by delivering precise and reliable data, allowing operators to manage and monitor large areas more effectively.
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P940 Modular Power Instrument
The P940 from Highland Technology (San Francisco, CA) is a modular power instrument intended primarily for aerospace testing. It consists of a 3U rackmount enclosure with main controller, power supply and cooling, and provision for installation of up to eight power, load, switching, or measurement modules. All modules include full measurement capability; each module’s measurable values (such as output voltage, current, and frequency) can be read remotely via Ethernet/USB. All modules include microsecond-resolution user-programmed parameter sequence tables. The P940 can also be controlled manually via front panel color LCD and controls.
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