White PaperSemiconductors & ICs
How Dual-Curing Adhesives (UV Light + Heat ) Improve Manufacturing
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For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.
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Overview
The white paper from Master Bond Inc. discusses the advantages of dual curing adhesives that utilize both UV light and heat in manufacturing processes. These adhesives, particularly cationic UV curable systems, offer significant benefits such as simplicity and consistency, as they are stable, single-component systems that do not require precise weighing, mixing, or monitoring of pot-life. This allows for unlimited working time, enabling parts to be assembled with fewer operational constraints.
One of the key features of UV curable adhesives is their fast, on-demand curing capability, which is especially beneficial for thermally sensitive substrates. These formulations are typically 100% reactive, free from volatile carriers or solvents, and energy-efficient. However, the paper also highlights potential drawbacks, such as the risk of under-cure in shadowed areas, which can lead to inconsistent material properties and limitations in adhesive thickness and joint design.
The paper emphasizes the importance of understanding the curing process, which is initiated by UV light exposure at specific wavelengths. The extent of curing is influenced by factors such as exposure time, light intensity, and adhesive thickness. To address the limitations of traditional adhesives, Master Bond’s dual-curing products, like UV15DC80 and UV22DC80-1, combine UV curing with low-temperature thermal post-cure, enhancing their mechanical, thermal, and electrical properties.
Additionally, the white paper discusses the future of UV curing technology, particularly the development of UV LED systems that emit at narrow wavelengths, offering safety, energy efficiency, and cooler operation. Master Bond is also exploring the use of these products in 3D printing applications, aiming to provide enhanced properties and resilience through photo-polymerizable resins with thermal post-cure.
In conclusion, the white paper presents dual curing adhesives as a transformative solution for manufacturing, addressing traditional challenges while offering improved performance and efficiency. For further inquiries, Master Bond encourages contacting their technical experts.