Factors Affecting Interconnects in Space
Electronic and electrical components and their interconnects continuously undergo extreme stress during the launch and orbit insertion of low-Earth-orbit (LEO) satellites. From vibration to electrostatic discharge, the consequences can be catastrophic when vital interconnects can’t withstand these demanding conditions. In this whitepaper, TE Connectivity (TE) discusses these factors, their influence on cost and solutions that will help designers meet mission objectives for launch vehicles, LEO satellites, and constellations employed in today’s new space economy.
Don't have an account? Sign up here.