Integrated Three-Dimensional Module Heat Exchanger for Power Electronics Cooling
Critical elements in the operation of electric drive systems are power electronics and power semiconductor packages. Improving thermal management of power electronics can help reduce the cost, weight, and volume of electric drive systems, and thus increase market acceptance. The power semiconductor packaging must provide the necessary electrical connections, while at the same time enabling heat removal from the semiconductor devices such as insulated gate bipolar transistors (IGBTs) and diodes.
An integrated three-dimensional module heat exchanger was developed for power electronics cooling. The design is fully integrated with a semiconductor package. Heat transfer happens from the top, bottom, and sides, ensuring maximum cooling. The design is stackable to form common power electronics building blocks, and is scalable and modular.
The integrated module heat exchanger consists of the following elements: cooling fins, heat spread plate, semiconductor package, space for bus bars, and control electronics or distributed capacitors. Optional features include heat spread tip fins and thermal insulators. Designs for liquid- and air-cooled systems are included as well. Preliminary finite element analysis has shown significant benefits relative to volume and cost when compared to existing cooling technologies for power semiconductor packages.
While the design was based on the needs of vehicle systems manufacturers, application of the technology is not limited. Other applications include variable speed motor drives for energy efficiency, solar power and microscale grid power electronics, wind power generation electronics, and others.
Air Force Completes First Magnetic Navigation Flight on C-17 - Mobility...
University of Rochester Lab Creates New 'Reddmatter' Superconductivity Material...
Air Force Performs First Test of Microwave Counter Drone Weapon THOR - Mobility...
INSIDERElectronics & Computers
MIT Report Finds US Lead in Advanced Computing is Almost Gone - Mobility...
Navy Selects Lockheed Martin and Raytheon to Develop Hypersonic Missile -...
Boeing to Develop Two New E-7 Variants for US Air Force - Mobility Engineering...
How Metal Additive Manufacturing Is Driving the Future of Tooling
Microelectronics Design Security: Better with Formal Methods
Solving Complex Thermal Challenges of Today’s Space Market
Manufacturing & Prototyping
Traction-Motor Innovations for Passenger and Commercial Electric...
5 Ways to Test Wearable Devices
Mastering the Challenges of the Software Defined Vehicle: Digital...