New Products

Rugged Conductive Cooled Computer

Conductive cooled CPU system

MPL (Dattwil, Switzerland) designed a new conductive cooled Xeon E-2276ME & i7-9850HE CPU system with integrated NVIDIA RTX 5000 GPU cards with 3072 CUDA Cores. The total solution requires no fan and can be operated in an environment from -20°C to +55°C. In addition to the GPU card, the system comes with additional features like: Up to 128 GB ECCDDR4; GigE ports; CAN ports; isolated serial ports; isolated digital IOs; dual HD-SDI; dual DVI; 12-32 VDC input according to MIL-STD-1275D; all packaged in an IP67 conductive cooled housing. The D38999 MIL connectors are soldered on special MPL designed rigid-flex PCBs. Particular attention has been paid to ensuring the entire system EMC is within the MIL-STD-461 standards and MIL-STD-810 can be met.

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12-Slot, 3U Backplane

12-slot backplane

Elma Electronic (Fremont, CA) has released a new 3U 12-slot backplane that aligns with The Open Group Sensor Open Systems Architecture™ (SOSA) Technical Standard 1.0. The backplane is an update to Elma's original CMOSS reference backplane supporting the U.S. Army's latest open-standards requirements. The new 3U OpenVPX backplane offers a mix of plug-in card (PIC) slots that enable complex, high-speed signal processing and system development, supporting up to 100 Gigabit Ethernet. The SOSA aligned backplane supports highspeed signals on all the data paths as well as incorporates leading-edge VITA 67.3 connectors compatible with legacy VITA 67.1 and VITA 66.4 RF and optical I/O connectors. The backplane features precision network timing (PNT) plus the integration of mixed payload modules including SBCs, switches, radial clocks and system expansion.

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Industrial Robot Firmware

Firmware for industrial robotic arm

Mecademic (Montreal, Canada) has released firmware version 8.4 for its Meca500 industrial robotic arm. Mecademic's firmware releases are provided free of charge, along with complimentary technical support. Although rotating Joint 6 beyond the ±180° has always been possible with the Meca500 R3, it was limited to joint-move-commands. With this new firmware, both point-to-point and linear commands can now be used outside of this limit. Apart from the benefit of no longer being limited in Cartesian space and requiring switching to Joint commands, new applications are now easier to implement directly with the Meca500. Users can now redefine the software limits of individual joints. The robot will not be able to move outside these limits. It will also generate an error if it starts from a position outside of the specified limits.

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OpenVPX Avionics Modules

OpenVPX™ avionics module

Mercury Systems, Inc. (Andover, MA) announced the new FIOVU-2180 and CI010-2080 6U OpenVPX™ avionics modules, the first safety-certifiable mul-ticore modules to incorporate the latest Intel ® Xeon® D-1700 processors (former code name Ice Lake D). The new modules feature BuiltSAFE proven, modular, commercial-off-the-shelf (COTS) elements complete with hardware and software DO-254 and DO-178 artifacts. In addition to Intel Xeon D-1700 processors, the new modules also feature dual Xilinx Virtex® UltraScale+™ XCVU9P FPGAs to support real-time algorithms; dynamically reconfigurable FPGA framework to simplify and speed FPGA programming; PCIe 3.0 interconnects and integrated 40Gb/S Ethernet to accelerate high-bandwidth applications; and board support packages for Wind River VxWorks™ to achieve FAA CAST-32A objectives.

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Instrument System

iQx™ instrument system

Advanced Thermal Solutions, Inc. (ATS) (Norwood, MA) has introduced the iQx™ instrument system - a device that measures air temperature and velocity, surface temperature, air pressure drop, and humidity. Measurements can be made concurrently or individually. The iQx™ system is equipped with input ports for up to eight air temperature/velocity sensors, four J-type thermocouples, two pressure sensors and one humidity sensor. These can be positioned in different locations within a system under test, such as an electronic enclosure. ATS provides all but the temperature/velocity sensors with the iQx. The iQx™ requires a PC/laptop with iSTAGE-X™ operating software to operate, record measurements, and present data. The system comes with the iSTAGE-X™ operating software.

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Multi-Band 5G Transceiver

Single-chip dual channel IF up/down converter

Anokiwave, Inc. (Boston, MA) has introduced the industry's first single-chip dual channel IF up/down converter with fully integrated LO synthesizer, delivering a single-chip multi-band solution that enables network operators to design smaller, lower cost, higher performance 5G radios across the entire 3GPP frequency range. The new AWMF-0224 is a half-duplex mmW to IF transceiver covering multiple 5G bands between 24 GHz to 30 GHz, and first in the family of the 5G IF transceivers. It integrates the entire mmW to IF signal chain for 5G radios, including dual up/down converters, driver amplifiers, multipliers, and LO synthesizer into a single silicon IC, without compromising performance. The AWMF-0224 IF Transceiver used in conjunction with Anokiwave's recently released AWMF-0221, 4th generation beamformer IC, allows OEMs to build entire mmW 5G radio front ends with two (2) IC types.

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Ka-Band COTM Phased-Array Satellite Antenna

Ka-band phased-array satellite antenna

ThinKom Solutions, Inc., (Hawthorne, CA) recently unveiled a new Ka-band phased-array satellite antenna for communications-on-the-move (COTM) applications. The new Thin-Sat® Ka500, based on ThinKom's VICTS (Variable Inclination Continuous Transverse Stub) technology, is a "turnkey" terminal that enables quick connection to existing and new Ka-band networks being deployed using satellites in geostationary (GSO) and non-geostationary (NGSO) orbits. It has the beam agility to track NGSO satellites as they move rapidly across the sky, as well as switch seamlessly between satellites. This new Ka-band antenna meets the Army's Capability Sets 25 and 27 (CS25 and CS27) and fully supports the DOD JADC2 requirements for military wheeled and tracked vehicles.

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Rad-Tolerant Network Attached Storage (NAS)

Aitech solid state drive

Aitech Systems (Chatsworth, CA) has released the new S999 Aitech solid state drive (ASSD™), a 2.5-inch solid state drive (SSD) with a raw storage capacity of 999,936,425,984 bytes, for high-performance spacecraft data processing or distributed computing systems in satellites and human-rated platforms. The unit can be paired with Aitech's S-A1760 Venus™, GPGPU AI supercomputer rated for space flight and small satellite constellations. This COTS-based system is validated for use in short duration and LEO/NEO environments through the Series 300 level ruggedization standard that identifies the rad-tolerant needs of space components and systems not used in deep space or long-haul applications. The S999 can also be certified to FIPS 140-2 or 140-3 requirements as an optional effort.

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Tactical sUAS System

Indoor tactical sUAS system

XTEND (Tel Aviv, Israel) — specialists in human-guided autonomous drone operating systems for military forces and law enforcement agencies — is launching the second generation of its indoor tactical sUAS system - the XTENDER. The micro-tactical ISR platform, with built-in resilient indoor-outdoor navigation and AI capabilities, enables remote completion of missions. Powered by "Skylord", XTEND's human-centric operating system, the XTENDER features complete localization and situational awareness, using virtual and augmented reality (VR/AR) technologies, coupled with advanced AI and machine learning flight algorithms, bringing the metaverse to the modern battlefield. Using patented Drone-Teaming and Mark & Fly technologies, both integrated into the operating system, the new generation of the XTENDER enables multiple drones to enter a remote target site carrying various payloads, perform the required tasks with extreme precision, and seamlessly exit, regardless of any indoor-outdoor transition limitations or GNsS-denied locations.

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3U VPX Processor Board

3U VPX module

VadaTech (Henderson, NV) announced the VPX703, a 3U VPX module based on the Freescale QorIQT4241 or T4161 with dual GbE and PCI x8 to the backplane. The module provides 64 GB of on-board flash and up to 12 GB DDR3. Standard I/O such as SATA, USB, GPIO, RS232, etc. are routed to the PI connector. Dual redundant (four channel) MIL-STD-1553A/B is provided via the P2 connector, based on the Data Device Corporation (DDC) DC BU-65863I8. The VPX703 is available in air- or conduction-cooled formats up to CC4/C3/V3/OS2 per ANSI/VITA 47.

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Hybrid Gigabit Ethernet Switch

Hybrid managed switch

The ComEth4412a from Interface Concept (Quimper, France) is a hybrid managed switch combining PCIe Gen3 (8GT/s) and 10/40 Gbs Ethernet technologies. It has been developed in alignment with the SOSATM (Sensor Open Systems Architecture) technical standard. The ComEth4412a Expansion/Data Plane PCIe lanes are generated by a high-performance non-blocking switch delivering up to 512GT/S of switching capacity, managing port bifurcating from ×l to ×l4, and offering 2 Non-Transparent Bridges (NTBs). The ComEth4412a Control Plane is based on the same technology as the ComEth4050e & ComEth4070e range using Marvell's highly integrated System-on-Chip (SoC) with programmable packet processors. The SoC delivers a combination of 1, 10 & 40 Gigabit Ethernet interfaces to the board. The ComEth4412a is compliant with the VITA 46.11 Chassis Management specification and includes an IPMI controller chip.

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OpenVPX Computers

Rugged computers

Two new rugged computers from Abaco Systems (Huntsville, AL) feature the recently introduced Intel ® Xeon® D-2700 processor delivering powerful 100Gb Ethernet (100GbE) capability. The HPC2812 6U VPX high-performance computer (HPC) and the SBC3612D VPX single board computer (SBC) are Abaco's first 100 GbE computationally intensive 6U and 3U SOSA-aligned boards. The HPC2812 and SBC3612D plug-in cards (PIC) include the Xeon® D-2700 processor (formerly known as Ice Lake). The 6U HPC2812 multiprocessor PIC is designed with dual (20 cores per node) Xeon D 2700 CPUs, per node 100 GbE with RDMA data plane and dual PCIe Gen4 expansion planes (P2 and P5). The computer also includes 128 GB DDR4 memory per node. The 3U SBC3612D compute intensive PIC (plug-in card) offers a 16-core Xeon D-2700 CPU, 100 GbE with RDMA data plane and PCIe Gen4 expansion plane (×8 or ×16 widths).

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Quarter-Brick, Non-Isolated DC/DC Converter

DC/DC converter

Flex Power Modules (San Jose, CA) has introduced the BMR350 quarter-brick, non-isolated DC/DC converter rated at 860W continuous and 1200W peak power, suitable as an intermediate bus converter for powering processors and ASICs with peak power demands. The product features an input of 40-60V (80V/100 ms) and a fully regulated output of 12V at 100A maximum, adjustable from 8V to 13.2V. An innovative transformer-coupled, non-isolated topology reduces component count and current stress and yields an efficiency level peaking at > 97.8% at half load 48V input voltage. Derating for the BMR350 is characterized by the innovative Flex Power Modules 3D thermal data graphs which specify available output power for given real-world pin and baseplate temperatures up to 100°C, with the user's airflow rate. This enables maximum power to be extracted without stress to the converter.

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Right-Angle RF Adapters

Right angle RF adapters

Pasternack (Irvine, CA), an Infinite Electronics brand, has expanded its line of high frequency, 1.85mm, right angle RF adapters. The devices are used in the military and commercial markets for satcom, wireless communications, test labs, R&D, and many other space-limited applications. Pasternack's new 1.85 mm right-angle adapters are precision manufactured to industry specifications and feature a maximum operating frequency of 67 GHz. They exhibit low VSWR of 1.35 (max) and provide mode-free operation up to 67 GHz. Also, these 50-ohm adapters feature stainless-steel construction for repeatability and reliability. The company also stocks a wide range of other right-angle adapters, including 2.4 mm, 2.92 mm, 3.5 mm, 4.3-10, 7/16 DIN, SMA, TNC, and Type-N.

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Plasma Thrusters

Plasma thruster

Satellite manufacturer Thales Alenia Space (Vernon, France) has chosen the Safran Aircraft Engines (Courcouronnes, France) PPS® 5000 plasma thruster to power six satellites in the second-generation Galileol global navigation satellite system (GNSS). These new-generation plasma (electric) thrusters, rated at up to 5kW, are designed to handle all different phases in the satellite's life, from transfer to operational orbit until disposal to a "graveyard" orbit at the end of the mission. Developed with support from the French and European space agencies, CNES and ESA, the PPS ® 5000 was fully qualified in June 2021 after logging more than 13,000 hours of full-power firing under vacuum conditions, corresponding to the over projected lifespan of these electric thrusters for a 15-year mission in geostationary orbit.

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Portable Power Systems

Portable battery system

Custom Electronics, Inc. (CEI) (Oneonta, NY) has released its CMP2500 portable battery system. At the heart of the CMP2500 battery system are LiFePO4 lithium-iron phosphate cells. Each battery has a 2.5 kWh capacity while the system provides up to 10 kWh capacity at 24 VDC or up to 5 kWh at 12 VDC. The batteries are housed in a rugged military-spec case that can be moved by one person, making it suitable for military and defense field and training applications including charging of drones, running simulations, targetry and silent watch. One of the unique features of the CMP2500 solution is its proprietary battery management system (BMS), custom designed to protect cells, equipment and the user. The inverters feature up to 4000W output and chargers up to 40 ADC.

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Edge Computing Platforms

Edge computing platforms

congatec (San Diego, CA) offers extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. congatec's rugged platforms with extended temperature options from -40°C to +85°C on the basis of Intel Atom x6000E Series, Intel Celeron and Pentium N & J Series processors are available as Computer-on-Modules in the SMARC, Qseven, COM Express Compact and Mini form factors, and also as Pico-ITX Single Board Computers (SBCs). The conga-HPC/cTLU COM-HPC Client Size A modules as well as the conga-TC570 COM Express Compact modules are available with new scalable 11th Gen Intel Core processors for extreme temperatures ranging from -40°C to +85°C. Both modules are the first to support PCIe ×4 in Gen 4 performance to connect peripherals with massive bandwidth. The brand new SMARC 2.1 Computer-on-Module with i.MX 8M Plus processor consumes only 2 - 6 watts.

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Human Machine Interface (HMI)

Expanded HMI product family

IDEC Corporation (Sunnyvale, CA) has expanded its HMI product family with the new HG2J Series 7" touchscreen HMI. The HMI's projected capacitive touch panel (PCAP) technology requires fewer layers than traditional analog resistive plastic films, and the self-capacitance technology can also prevent accidental input due to water droplets. It is also more resistant to scratches, won't turn yellow in the sun, and has a higher tolerance for dirt deposits, and for contact with cleaning or washdown chemicals. Fewer layers and better light transmission ratings mean less backlight power is needed while providing 500 cd/m2 brightness level and 50,000-hour backlight life. With a TFT LCD display resolution of 800×480 pixels, the HG2J HMI is conveniently sized for applications both small and large.

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3U VPX Plug-In Card

3U VPX Plug-in Card

Concurrent Technologies (Colchester, UK) launched a new 3U VPX Plug-in Card (PIC) designed in alignment with the SOSA™ Technical Standard. This new I/O intensive processor is targeted for use in a variety of Situational Awareness and Intelligence, Surveillance and Reconnaissance (ISR) applications that need a combination of general-purpose processing augmented with image processing and artificial intelligence (AI) acceleration. TR K9x/6sd-RCx is based on an 11th Gen Intel® Core™ processor, which has up to 4 CPU cores mated with 16 Gbytes of soldered DDR4 DRAM with in-band Error Correction Code for high-performance general-purpose compute tasks. The Intel® Iris ® Xe Graphics integrated into the product adds up to 96 Execution Units for AI and acceleration when utilized by an OpenCL, oneAPI or OpenVINO™ application. Extra processing or I/O can be included within a single slot via the onboard XMC site.

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