Front I/O Industrial Computers
DuroPC (Blairsville, PA) has unveiled a new line of front I/O bracket industrial rackmount computers. RAC183, RAC184, RAC185 & RAC186 merges the best of the DuroPC line of Intel® Core™ and Pentium™ systems with the ease of access provided by the units’ 2 front USB ports. and easy access to your expansion devices.
RAC183: 4U rackmount with front accessible I/O Core 2 Duo 2.4GHz with 9-ISA 4-PCI, 1GB RAM, Intel® Q35+ICH9 chipset, VGA, 9-ISA/4-PCI expansion slots, dual gigabit LAN, 48X DVDRW, 160GB HDD, 300W power supply.
RAC184: 4u Core 2 Duo 2.4GHz rackmount with front accessible I/O with 12 PCI, 1 ISA, 1GB RAM, Intel® Q35+ICH9 chipset, VGA, 12-PCI/1-ISA expansion slots, dual gigabit LAN, 48X DVDRW, 160GB HDD, 300W power supply.
RACA185: 4U rackmount industrial computer with ® front accessible I/O, Intel CoreTM2 Duo 2.4 GHz, 1GB RAM, Intel® Q45+ICH10 chipset, VGA, dual gigabit LAN, 4-PCI, 1-PCIe 1, PCIe × 4, PCIe × 16, 48X DVDRW, 160GB HDD, 300W power supply.
RAC186: 4U rackmount ATX motherboard computer with front accessible I/O, 3.0 GHz Pentium 4 CPU, 1GB RAM, Intel® 865G chipset, VGA, 2-ISA, 5-PCI, 1-AGP-8x expansion slots, dual LAN (1×10/100, 1×10/100/1000 Base-T), 48X DVD-RW, 160GB HDD, 300W power supply.
For Free Info Click Here
Top Stories
INSIDERAerospace
Venus Aerospace’s Rotating Detonation Rocket Engine Completes First Flight...
NewsUnmanned Systems
ACT Expo 2025: Heavy-Duty EVs, H2 Trucks and Tariff Talk Dominate Day One
INSIDERCommunications
How the US Army is Advancing Research in Robotics, AI and Autonomy
INSIDERSoftware
Bombardier is Digitally Upgrading its Aircraft Design, Engineering and...
INSIDERDesign
Quarterhorse Hypersonic Test Aircraft Completes First Flight
Technology ReportTransportation
Webcasts
Defense
Soar to New Heights: Simulation-Driven Design for Safety in...
Software
Improving Signal and Power Integrity Performance in Automotive...
Manufacturing & Prototyping
Transforming Quality Management with Data-Driven Analytics
Manufacturing & Prototyping
Precision Under Pressure: The Centerless Grinding Advantage in...
Photonics/Optics
Breaking Barriers in Space Communication with Optical Technology