New Products

June 1, 2025

Power Relays

Microchip (Chandler, AZ) announced the release of its BR235 and BR235D series of 25A QPL hermetically sealed electromechanical power relays that meet the requirements of MIL-PRF-83536 specification and ISO-9001 certification. This new series of power relays is specifically engineered for mission-critical commercial aviation, defense and space applications. These devices offer supply certainty coupled with global technical support. The series provides a 25A 3PDT rating and offers multiple variants for design flexibility. Options are available in suppressed or non-suppressed, coil voltages from 6–48 VDC and 115 VAC, mounting styles with and without mounting tabs in different orientations, straight or J-Hook terminal pin types, and tin or gold plating.

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Spectrum Defender

In a message shared with the RF community, Sean Wallace of Spectra Lab (Dumfries, VA) explained that Bird Technologies, known for its X-COM division and the IQC line of RF recorders, is shifting its focus toward core competencies such as RF power measurement. This shift marks the end of an era for their widely used IQC line. To help the industry transition, Spectra Lab has introduced new features to its Spectrum Defender product. The most notable of these features is the ability to record directly in the X-COM file format, enabling users with existing X-COM workflows or large X-COM file libraries to continue their operations seamlessly. Furthermore, users of Bird’s SpectroX analysis software will now be able to record new signals in Spectrum Defender and open them instantly in SpectroX, with no conversion needed.

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Single Pair Ethernet Cable

PIC Wire & Cable’s (Waukesha, WI) new Single Pair Ethernet (SPE) represents the next evolution in connectivity solutions for aerospace applications. The SPE has a compact and light-weight design that reduces weight and space requirements by up to 50 percent to four-pair Ethernet cables, enhancing fuel efficiency and reducing emissions. The E1G4222 cable revolutionizes aerospace networking by replacing traditional four-pair Ethernet cables with an advanced single-pair design. This breakthrough enables gigabit-speed data transmission with reduced space and weight requirements, all while ensuring superior signal integrity and durability.

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High Performance Recorder

Galleon Embedded Computing (Oslo, Norway) has completed comprehensive environmental qualification testing for their new high performance recorder (HPR). This milestone certification ensures reliable performance for intelligence, surveillance, and reconnaissance (ISR) operations, military training and debriefing, and airborne and marine surveillance applications in the most challenging operational environments. The server/network-attached storage device/ recorder provides customers with a robust solution featuring up to 32TB of storage and 5GB/s recording speeds.

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SOSA Aligned ATR Enclosures

Pixus Technologies (Waterloo, Ontario) has developed new SOSA aligned ATR enclosures utilizing the 3U OpenVPX form factor. The various chassis platforms typically support 100GbE or higher speeds. The new ARINC 404 5/8 size ATRs from Pixus features customized I/O options and various SOSA slot profile options, including RF and optical interfaces through the backplane. For chassis management, the ATR has the option of implementing Pixus’ SOSA aligned Tier 3 mezzanine-based solution that sits behind the backplane.

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Next Generation Servers

Dedicated Computing (Waukesha, WI) announced its latest portfolio of high-performance servers powered by Intel® Xeon® 6 processors. Designed to meet the growing demands of AI, edge computing, and industrial workloads, this new portfolio delivers unparalleled scalability, efficiency, and processing power for OEMs and enterprises seeking cutting-edge performance. At the core of the latest server portfolio is the Intel® Xeon® 6 processor family. Featuring up to 86 cores per CPU, DDR5 memory support up to 6400 MT/s, and 96 lanes of PCIe Gen 5 connectivity, these processors enable seamless execution of compute-intensive and scale-out workloads.

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Uninterrupted Bevel Cutting

Lantek (Mason, OH) and ZINSER have jointly developed an innovative solution that revolutionizes bevel cutting in pre-cut parts. Traditionally, bevel cutting was performed within the nesting process, often causing issues such as collisions, cutting inaccuracies, or production slowdowns. The industry is now shifting towards a more efficient approach: first, parts are cut on a high-production machine, and then those requiring bevels are transferred to a dedicated bevel-cutting machine. Through a custom-developed postprocessor for ZINSER machines, Lantek’s software uses sensory data to accurately calculate each part’s position and orientation, automatically adjusting the cutting parameters to ensure precise execution.

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CoroCut 2: New Parting and Grooving Geometries

Sandvik Coromant (Mebane, NC) is expanding its versatile CoroCut® 2 with a new -GL parting and grooving geometry, and an updated -CR parting-off geometry. This expansion in geometries will make a significant difference to workshops machining in hard-to-chip steels and in parting-off operations where a strong edge is needed. Featuring the most aggressive chip breaker in the Coro-Cut 2 concept, the new -GL geometry is ideal for workshops requiring better chip control in demanding ISO P components, such as low-carbon steel, clean steels and cold-forged automotive components. The -CR geometry is the first choice for parting-off operations at higher feeds or during intermittent cutting and is suitable for a wide range of materials.

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Direct Time of Flight LiDAR Sensor

Sony Electronics Inc. (Paramus, NJ) announced commercialization of the AS-DT1 LiDAR Depth Sensor. The AS-DT1 is the world’s smallest and lightest LiDAR Depth Sensor structure measuring just 29mm × 29mm × 31mm (approximately 1.14 inch width × 1.14 inch height × 1.22 inch depth), excluding protrusions, and weighing only 50g (approximately 1.76 ounces). The AS-DT1 utilizes ‘Direct Time of Flight (dToF)’ LiDAR technology. The proprietary dToF ranging module, equipped with a Single Photon Avalanche Diode (SPAD) sensor, utilizes multiple ranging points for distance measurement, and can accurately measure distances in three dimensions: length, width, and depth.

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Blackwell-Based VPX Computing Modules

WOLF Advanced Technology (Aurora, Ontario) unveiled four NVIDIA® Blackwell-based VPX modules designed for mission-critical edge AI applications. Leveraging NVIDIA® Blackwell GPUs, these 3U and 6U VPX modules deliver unprecedented AI inference capabilities while operating in harsh environments. The WOLF-1636 redefines rugged AI processing with NVIDIA’s Blackwell RTX 5000 embedded GPU, featuring 10,496 CUDA cores and 320 fifth-generation Tensor Cores. Its 24GB GDDR7 ECC memory achieves up to 896GB/s bandwidth — 55 percent faster than prior generations, enabling larger data sets to reach the GPU for real-time processing.

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IQ-Core Software

Curtiss Wright Defense Solutions (Ashburn, VA) has announced enhancements to its IQ-Core® Software suite. IQ-Core Software is a software application designed for secure, tactical, and distributed network management – ideal for edge networks in disconnected, intermittent, and limited (DIL) environments. New IQ-Core software capabilities include: Enhanced security via support for smartcard and CAC multi-factor authentication; REST- based Application Programming Interfaces (API); Suite of powerful new features to enhance the management and maintenance of INTEGRITY™ Global Security (IGS) security appliances. The addition of support for the industry-standard REST API enables IQ-Core Software customers to easily integrate with third-party platforms.

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DC-DC Converter Modules

Vicor’s (Andover, MA) non-isolated, regulated DC-DC converter modules operate from a 40 – 60V input, generate a regulated 12V output, and are adjustable from 10V to 12.5V. They support up to 2000W and can be paralleled to attain higher power levels. The DCM has established a new benchmark for power density with a low-height, surface mount Converter housed in Package (SM ChiP), resulting in a 6x reduction in size over a conventional converter. With Vicor proprietary high frequency switching technology, these modules deliver high efficiency over all line and load conditions. They can be used to establish a 12V bus or used with legacy, downstream point-of-load (PoL) converters, and are ideally suited for bridging 48V and legacy 12V power buses in industrial, aerospace and defense, and high performance computing applications.

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High Voltage DC-DC Converter

Crane A&E’s (Lynwood, WA) new High Voltage DC-DC Converter provides customers an innovative, unmatched power conversion solution. Crane A&E has used its more than 60 years of electrical power expertise to develop a one-of-a-kind, highly-efficient, high-power density DC-DC power converter. Crane A&E’s new converter is engineered to support multiple power sources and cooling options to meet and exceed customer demand. With tremendous flexibility, our new 4kW power converter can be paralleled to match customer needs. The converter’s cooling modules also support liquid, fan or conduction cooling.

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Non-Drip Cryogenic Epoxy

Master Bond’s (Hackensack, NJ) EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250 °F. EP29LPSPND-3 features a coefficient of thermal expansion of 45-50 x 10-6 in/in/°C, a tensile strength of 6,000-8,000 psi, and a Shore D hardness of 70-80. This system has a volume resistivity exceeding 1015 ohm-cm at 75 °F and a dielectric constant of 4.2 at 60 Hz.

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S-A2300 AI Supercomputer

Aitech (Chatworth, CA) announced a significant milestone in AI technology with the S-A2300 COTS AI supercomputer. Leveraging NVIDIA’s GPGPU Orin architecture, the new groundbreaking AI supercomputer is specifically designed for Low Earth Orbit (LEO) missions and integrates exceptional computational power with advanced AI functionalities. The S-A2300 provides up to 2048 CUDA cores and 64 Tensor cores that reach up to 248 TOPS. The system also features two scalable, highly configurable, dedicated NVDLA (NVIDIA Deep-Learning Accelerator) engines that simplify integration and portability, as well as promote a standard way to design deep learning inference accelerators.

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Electro-Mechanical Actuator Subsystem

Regal Rexnord (Milwaukee, WI) is advancing the next generation of electro-mechanical actuators purpose-built for the unique requirements of aerospace and defense applications. The company’s expanded offering in subsystems leverages the unique strengths of its trusted portfolio, spanning high-performance motors, rotary and oscillatory bearings, dynamic seals, resolvers, magnetics, ball and lead screws, clutches, and brakes. Solutions are designed and manufactured in-house at one or more of our 12 global AS9100-certified facilities, enabling accelerated transitions from prototyping to full-scale production.

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SOSA-Aligned 3U VPX GPGPU Card

AMETEK Abaco Systems (Huntsville, AL) is excited to introduce the GRA117S, a SOSA-aligned Open VPX 3U video graphics and GPGPU card. It’s powered by the NVIDIA RTX™ GPU with 16 GB GDDR6 ECC memory and is designed to support AI and deep learning capabilities. Designed for extreme environments and mission-critical applications, the GRA117S offers a wide range of advanced features, including: NVIDIA RTX™ 5000 GPU (Ada Lovelace Architecture); 16 GB of GDD56 advanced graphics memory with error correction code (ECC); PCI Express Gen 4 connectivity support offering flexibility and ultra-fast data transfer speeds; SOSA slot profile 14.6.11 and 14.6.13 compatibility.

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Condor GR6S-AD2000

EIZO (Orlando, FL) has introduced the Condor GR6S-AD2000 - a ruggedized 3U OpenVPX form factor video graphics and GPGPU card powered by the NVIDIA RTX™ 2000 Ada Generation Embedded GPU. The Condor GR6S-AD2000 is a SOSA®-aligned, I/O-intensive 3U VPX video capture solution designed for high-performance computing systems that require real-time video capture and AI-accelerated data processing. It supports up to six 12G-SDI video streams, including four dedicated inputs and two dedicated outputs. This flexible I/O architecture enables seamless multi-video ingestion, processing, and transmission, enhancing real-time situational awareness in mission-critical applications.

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