Thermal Aging in Molded Power Inductors

The market demand to increase power density and efficiency in a smaller form factor, has pushed each element to its limits. Moreover, higher power requirements and miniaturization expose passives to rising temperatures, increasing the probability of thermal aging.

This white paper discusses the issues of inductors when exposed to high temperatures for extended time, with a special focus on molded high-current power inductors and how to select inductors considering the effect of thermal aging.

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