SHIP Prototype Computer Chip

BAE Systems, Inc.
Arlington, VA

The U.S. Department of Defense (DoD) has celebrated a milestone achievement for the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) with the delivery of the first SHIP prototype devices from Intel and Qorvo to BAE Systems.

The SHIP program was established to develop pathways for sustained DoD access to state-of-the-art (SOTA) microelectronics packaging capabilities by leveraging commercial industry production flow to meet the DoD’s requirement for highly customized parts. Utilizing the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Agreement (OTA), the SHIP program has partnered with Intel and Qorvo to develop prototype devices that will be transitioned to DoD systems through the defense industrial base (DIB) to demonstrate enhanced capabilities and size, weight, and power (SWaP) savings beneficial to the warfighter.

The first two of these prototypes—Intel’s Multi-Chip Package (MCP-1) for SHIP Digital and Qorvo’s Multi-Chip Module (MCM-1) for SHIP RF — were delivered to the lead DIB demonstrator, BAE Systems, during a ceremonial gathering held by Heidi Shyu, Under Secretary of Defense for Research and Engineering (USD(R&E)) and the S2MARTS OTA Manager, National Security Technology Accelerator (NSTXL), at BAE Systems’ facility in Falls Church, Virginia.

Additional prototype devices are in development under the SHIP program. Under SHIP Digital, both MCP-1 and MCP-2 contain SOTA chiplets with advanced functionality, low power, smaller size, and cutting-edge performance along with Intel’s Agilex advanced field programmable gate array (FPGA) technology. As the next phase of the SHIP Digital effort, the DoD has initiated the Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project to solidify pathways to transition of both devices to DoD systems.

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