New Products

Hybrid Power Drive Module

Aircraft manufacturers designing more electric aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities. To meet the needs for an integrated and configurable power solution for aviation applications, Microchip Technology Inc. (Chandler, AZ) has introduced a new comprehensive hybrid power drive module, the first variant introduced in the new product line of power devices that will be available in 12 different variants with either silicon carbide (SiC) MOSFETs or insulated-gate bipolar transistors (IGBTs).

These hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of MEAs.

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PCI Express Processor Board

TECHWAY (Yvette, France) announces its new Kintex UltraScale+ PCIe board with FMC+ site, called PFP-IV and using all the benefits of VITA 57.4 flexibility. The board is 100 percent compliant with the FMC+ standard. The new PFP-IV is a multi-purpose PCIe platform with FMC+ site based on the powerful Xilinx Kintex UltraScale+ FPGA.

Kintex UltraScale+ devices provide the best price/performance/high-end features, delivering a cost-effective solution for applications that require high-end capabilities. PFP-IV is versatile thanks to its technology mix: Kintex UltraScale+ FPGA, FMC+ site, DDR4 memories, SoM based on Zynq UltraScale+ MPSoC, management system and 28 Gbps optical links. The optional System-on-Module (SoM) offers powerful CPU capabilities, allowing offloading of complete application (processing + management).

PFP-IV is compliant with third-party FMCs on the market. Fully compliant with common standards (VITA 57.4, PCIe, AXI4, etc.), this Kintex UltraScale+ PCIe board was designed to easily fit into existing system or brand-new architecture. PFP-IV can be easily used in a standard PC environment with development kit available for both Windows and Linux, or in stand-alone mode in your own enclosure.

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SOSA-Aligned 3U VPX FPGA Modules

New Wave DV (Minneapolis, MN) announced the addition of SOSA aligned 3U VPX solutions to its product line. The new V6061 and V6063 VPX modules feature Xilinx® Versal® Adaptive Compute Acceleration Platform (ACAP) Prime and AI options, NVIDIA® (Mellanox ®) network interface devices, and high-bandwidth optical IO options, providing system developers the cutting-edge technology required for high-bandwidth processing in critical environments.

“The V6061/V6063 are specifically targeted at applications requiring a combination of high-speed data interfaces, heterogeneous (ACAP) processing resources, network protocol offloads, and optional data distribution to adjacent processing resources such as CPUs and GPUs in the system,” said Jake Braegelmann, Vice President of Business Development, New Wave DV.

Use cases for the V6061/V6063 include sensor interfacing, data processing, data distribution, and FPGA co-processing. These modules will benefit radar, signal intelligence, electronic warfare, video, storage, medical imaging, and embedded communications systems.

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VPX Timing Card

Brandywine Communications (Tustin, CA), in partnership with Reach Technologies, are proud to introduce the VPX Timing Card, a ruggedized conduction cooled timing unit that provides versatile multifunction clock references for any environment. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers, or secure SAASM M-Code GPS receiver data along with external 1PPS UTC rollover references, reference clocks of up to 100MHz, as well as Amplitude Modulated (AM) or DC Level Shifted AM (DCLS) IRIG inputs as means of synchronization via the VITA 67.3C backplane RF connector.

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Expanded 3U OpenVPX Backplanes

Elma Electronic (Fremont, CA) has now added six additional high-speed backplanes that align with The Open Group Sensor Open Systems Architecture™ (SOSA) Technical Standard 1.0 and incorporate the latest optical fiber and RF connectivity. With 2-, 4- and 6-slot options, the expanded 3U OpenVPX series of backplanes provides development options to meet the complex demands of high-performance rugged military operations. Designed to help accelerate development of a common, modular architecture across critical C5ISR and EW systems, Elma’s comprehensive line of SOSA aligned backplanes supports the Modular Open Systems Approach (MOSA) standardization initiative from the U.S. Department of Defense (DoD). The series incorporates current Ethernet and PCI Express standards as well as optimizes SWaP and lowers lifecycle costs for rapid technology insertion.

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Air Transport Rack Chassis

Annapolis Micro Systems (Annapolis, MD) has introduced a rugged WILD100 8-Slot 3U OpenVPX SOSA™-Aligned Air Transport Rack (ATR) Chassis (WC3A80) and two WILD100 19” Rackmount 3U OpenVPX Chassis (WC31E0 & WC31DH). The new chassis join the WILD100 Family of Annapolis Chassis, Backplanes & Chassis Managers, most of which were developed in alignment with the Sensor Open Systems Architecture (SOSA) Technical Standard and support C5ISR/EW Modular Open Suite of Standards (CMOSS).

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Low Power Microcontroller

Renesas Electronics Corp. (Tokyo, Japan) introduced a new general-purpose microcontroller (MCU) in the low-power RL78 Family, with small package sizes that target 8-bit MCU applications. The versatile RL78/G15 packs many peripheral functions and 4-8KB of code flash memory in package sizes ranging from 8 to 20 pins, with the smallest 8-pin device measuring only 3 x 3 mm. These features are designed to keep system size small and reduce the cost of end systems, such as industrial, consumer, sensor control, lighting, and inverter applications. In addition, the maximum operating ambient temperature of 125 °C facilitates optimal thermal design, covering a wide temperature range and allowing the MCU to be used near heat-generating components such as inverter motors.

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X9 Venom Xeon D Host Processor Board

General Micro Systems (San Diego, CA) has launched its X9 Venom Xeon D Host 3U VITA 65 OpenVPX single-board computer. Aligned to the SOSA (Sensor Open Standard Architecture) Technical Standard, this family of high-performance modules support the demanding needs of next-generation warfare with massive, flexible I/O and compute capabilities in multiple configurations. These single-board computers are powered by up to 20 Intel® Xeon® D-2700 HCC (formerly Ice Lake D) cores, and unprecedented bandwidth via inter-chassis and front-panel connectivity with Thunderbolt™ 4, PCIe Gen 4, USB, and 100 GbE ports.

What makes these single-board computers (SBCs) most unique is the compact combination of so much ultra-speed I/O at 40Gbits/s or 100Gbits/s, up to three processors per module, and the breadth of modular, application-specific I/O that interfaces with all manner of defense systems and platforms.

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UAS Command and Control

Drone avionics manufacturer uAvionix (Bigfork, MT) introduced an updated product line offering for uncrewed aircraft system (UAS) beyond visual line of sight (BVLOS) command and control (C2). The SkyLine™ C2 management platform ecosystem is headlined by muLTElink™, an industry first combination of LTE technology with broadcast radio frequency (RF) radios which permit dynamic selection of the best radio link at any given moment between LTE, unlicensed industrial, scientific and medical (ISM) frequencies, or aviation protected C-Band in a single low-SWaP avionic device. Designed for integrated operation with the uAvionix SkyLine™ C2 management platform, the combination of muLTElink and SkyLine enable a self-healing C2 network capable of both path diversity and link diversity eliminating lost-link possibilities over broad terrain and altitude ranges.

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Sinergy Family of Connectors

AirBorn (Georgetown, TX) launches its all-new SInergy line of interconnects. SInergy offers OEMs a mini-modular hybrid solution in 1-5 configurable bays. With speeds up to 25Gbps per lane or 75Gbps aggregate bidi bandwidth, SInergy meets requirements for XAUI, USB 3.0, PCIe Gen 3/4, SAS-3/4, and Ethernet (10G/25G per lane) applications. Exemplifying milgrade resilience, high-speed, high-density SInergy connectors are tested & qualified based on MIL-DTL-83513 performance requirements. SInergy’s modularity means OEMs have multiple signal-carrying options in any configuration of signal or SMPM RF interfaces, in one to five bays.

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Rogue Carrier for Jetson AGX Orin

Connect Tech Inc. (Guelph, Canada) has introduced the Rogue Carrier for Jetson AGX Orin as a full featured carrier board specifically designed for commercially deployable platforms. Rogue for Jetson AGX Orin provides access to an impressive list of latest generation interfaces on the Jetson AGX Orin while adding additional interfaces of 2x 10GbE, 3x USB 3.1, HDMI and a locking Mini-Fit Jr. power input connector. Integrations with external storage and Wi-Fi/Bluetooth via Intel 8265 are also available.

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COM-HPC Mini Modules

Congatec (Deggendorf, Germany) introduces the new COM-HPC Mini designs. Launching officially after final PICMG ratification of the new specification, the first high-performance COM-HPC Mini modules will be equipped with the new 13th Gen Intel Core processors (codename Raptor Lake), which represent the latest benchmark for the high end of embedded and edge computing at client level. The COM-HPC Mini form factor predominantly addresses ultra-compact high-performance designs such as DIN rail PCs or rugged handhelds and tablets. However, COM-HPC Mini also solves the Gordian knot that developers of ultra-compact COM Express systems have been facing when wanting to switch to COM-HPC to be able to utilize latest interface technologies.

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PCI Express Mini Card

TEWS (Halstenbek, Germany) extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous standard full PCI Express Mini Card module with three high speed serial data communication channels. The TMPE863 is designed for data communications, LAN/WAN networking, traffic control, simulation, telecommunications, and COTS applications.

To minimize obsolescence issues, the serial communication controller is implemented in FPGA logic along with the bus master capable PCIe interface, guaranteeing long term availability and having the option to implement additional functions in the future. Data transfer to and from host memory is handled via TMPE863 initiated DMA cycles for minimum host/CPU intervention. Each channel has a receive and transmit FIFO of 512 long words (32 bit) per channel for high data throughput.

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