SUMIT-micro™ Expansion Modules

VersaLogic Corp. (Eugene, OR) has released two new expansion modules for use with SUMIT™-based products. The expansion modules feature the SUMIT (Stackable Unified Module Interconnect Technology) interface standard developed by the Small Form Factor Special Interest Group (SFF-SIG™). The SUMIT interface provides a variety of signaling options for system expansion, including multiple high-speed PCI Express (PCIe) lanes, USB, LPC, SPI, and SMBus.

The expansion modules are the first of the new SUMIT-micro™ format, which is 1/3 the width of PC/104 or SUMIT-104 expansion modules. SUMIT-micro expansion boards are 90 × 32 mm, versus SUMIT-104 boards which are 90 × 96 mm. SUMIT-micro boards attach to the SUMIT connector and are secured via two mounting holes using standard standoffs. These new expansion boards provide up to four additional USB ports for SUMIT-based systems. The VL-EPHs-B1A model provides four USB ports (two Type A connectors and two on pin headers). The VL-EPHs-B1B provides three USB ports (one Type A connector and two on pin headers) and one eUSB flash memory expansion site. Windows® CE, QNX®, and VxWorks®.

Both versions are designed for full industrial (-40° to +85°C) temperature operation, are RoHS compliant, and meet MIL-STD-202G specifications for mechanical shock and vibration for use in harsh environments.

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Embedded Technology Magazine

This article first appeared in the June, 2011 issue of Embedded Technology Magazine (Vol. 5 No. 3).

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